SNOSDL7A January   2025  – December 2025 LMG3650R070

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Switching Parameters
      1. 6.1.1 Turn-On Times
      2. 6.1.2 Turn-Off Times
      3. 6.1.3 Drain-Source Turn-On and Turn-off Slew Rate
      4. 6.1.4 Zero-Voltage Detection Times (LMG3656R070 only)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 LMG3650R070 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Drive Strength Adjustment
      2. 7.3.2 VDD Supply
      3. 7.3.3 Overcurrent and Short-Circuit Protection
      4. 7.3.4 Overtemperature Protection
      5. 7.3.5 UVLO Protection
      6. 7.3.6 Fault Reporting
      7. 7.3.7 Auxiliary LDO (LMG3651R070 Only)
      8. 7.3.8 Zero-Voltage Detection (ZVD) (LMG3656R070 Only)
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Slew Rate Selection
        2. 8.2.1.2 Signal Level-Shifting
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Using an Isolated Power Supply
      2. 8.3.2 Using a Bootstrap Diode
        1. 8.3.2.1 Diode Selection
        2. 8.3.2.2 Managing the Bootstrap Voltage
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Solder-Joint Reliability
        2. 8.4.1.2 Power-Loop Inductance
        3. 8.4.1.3 Signal-Ground Connection
        4. 8.4.1.4 Bypass Capacitors
        5. 8.4.1.5 Switch-Node Capacitance
        6. 8.4.1.6 Signal Integrity
        7. 8.4.1.7 High-Voltage Spacing
        8. 8.4.1.8 Thermal Recommendations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 11.1 Tape and Reel Information
    3. 11.2 Mechanical, Packaging, and Orderable Information

8.4.1.1 Solder-Joint Reliability

Because TOLL packages are typically used in high-current applications, verify that the SRC and DRN pads are solder-mask defined (SMD). In practical layout, source and drain pads are often connected to the copper planes that make the largest possible contact area to the PCB to maximize conductivity. Establish that the other solder pads, which carry minimal current and are primarily used for signal connections, are non-solder-mask defined (NSMD), as shown in the land pattern example in Mechanical, Packaging, and Orderable Information. Finally, verify that any board trace in connection with an NSMD pad is less than 2/3 the width of the pad on the pad side where the board trace connects. The trace must maintain the 2/3 width limit for as long as the trace is not covered by solder mask. After the trace is under solder mask, there are no limits on the trace dimensions. All stated recommendations are followed in Layout Example.