SNVA853C December 2019 – March 2024 LMZ10500 , LMZ10501 , LMZ20501 , LMZ20502 , LMZ21700 , LMZ21701 , LMZ30604 , LMZ31506 , LMZ31520 , LMZ31530 , LMZ31704 , LMZ31707 , LMZ31710 , LMZ34202 , LMZ35003 , LMZ36002 , LMZM23600 , LMZM23601 , LMZM33602 , LMZM33603 , LMZM33604 , LMZM33606 , TLVM13610 , TLVM13630 , TLVM13640 , TLVM13660 , TLVM23615 , TLVM23625 , TPS82085 , TPS82130 , TPSM265R1 , TPSM33615 , TPSM33625 , TPSM365R3 , TPSM365R6 , TPSM53604 , TPSM5601R5 , TPSM5601R5H , TPSM5601R5HE , TPSM560R6 , TPSM63603 , TPSM63604 , TPSM63606 , TPSM63608 , TPSM63610 , TPSM84424 , TPSM84624 , TPSM846C23 , TPSM846C24 , TPSM84824
2.2 QFN Overmolded
The QFN overmolded package can be based on a leadframe or a PCB laminate. The package integrates the inductor, power IC, along with programming components. The leadframe-based package uses a thick copper leadframe for routing. The PCB laminate based package uses a thin multilayer PCB for mounting and routing all of the integrated components and signals. See the illustrations in Figure 2-2 and Figure 2-3 for examples of these QFN module packages.
Figure 2-2 LMZ36002 (60V, 2A) Module
in Leadframe-based Overmolded QFN Package
Figure 2-3 TPSM84A21 (14V, 10A)
Module in PCB Laminate Based Overmolded QFN Package