LMZ31704

ACTIVE

2.95V to 17V, 4A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Package

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Product details

Parameters

Iout (Max) (A) 4 Vin (Min) (V) 2.95 Vin (Max) (V) 17 Vout (Min) (V) 0.6 Vout (Max) (V) 5.5 Soft start Adjustable Features Current Sharing, EMI Tested, Frequency Synchronization, Power Good, Remote Sense, Tracking, Light Load Efficiency Operating temperature range (C) -40 to 85 Iq (Typ) (uA) 800 Regulated outputs (#) 1 Switching frequency (Max) (kHz) 1200 Switching frequency (Min) (kHz) 200 Switching frequency (Typ) (kHz) 1000 Duty cycle (Max) (%) 100 Topology Buck, Synchronous Buck open-in-new Find other Buck modules (integrated inductor)

Package | Pins | Size

B3QFN (RVQ) 42 100 mm² 10 x 10 open-in-new Find other Buck modules (integrated inductor)

Features

  • Complete integrated power solution allows
    small footprint, low-profile design
  • 10-mm × 10-mm × 4.3-mm package
    • Pin compatible with LMZ31710 and LMZ31707
  • Efficiencies up to 95%
  • Eco-mode™ / light load efficiency (LLE)
  • Wide-output voltage adjust
    0.6 V to 5.5 V, with 1% reference accuracy
  • Supports parallel operation for higher current
  • Optional split power rail allows
    input voltages down to 2.95 V
  • Adjustable switching frequency
    (200 kHz to 1.2 MHz)
  • Synchronizes to an external clock
  • Provides 180° out-of-phase clock signal
  • Adjustable slow start
  • Output voltage sequencing / tracking
  • Power good output
  • Programmable undervoltage lockout (UVLO)
  • Overcurrent and overtemperature protection
  • Pre-bias output start-up
  • Operating temperature range: –40°C to 85°C
  • Enhanced thermal performance: 13.3°C/W
  • Meets EN55022 Class B emissions
    • Integrated shielded inductor
  • Create a custom design using the LMZ31704 with the WEBENCH® Power Designer

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Description

The LMZ31704 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.

The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31704 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

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Technical documentation

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Type Title Date
* Datasheet LMZ31704 4-A Power Module with 2.95-V to 17-V Input and Current Sharing in QFN Package datasheet (Rev. E) Feb. 25, 2020
Application note Soldering Requirements for BQFN Packages (Rev. C) Mar. 05, 2020
Application note Practical Thermal Design With DC/DC Power Modules (Rev. A) Nov. 20, 2019
Application note Soldering Considerations for Power Modules Nov. 26, 2018
Selection guide Innovative DC/DC Power Modules Selection Guide (Rev. C) Feb. 27, 2018
Technical articles FPGA power made simple: design steps Nov. 20, 2017
White paper Simplify low EMI design with power modules Nov. 20, 2017
Application note Working With QFN Power Modules (Rev. A) Jun. 08, 2017
Application note Power Module MSL Ratings Jan. 20, 2017
Application note Using LMZ31710 for Higher Output Voltages Nov. 09, 2015
Application note Adjusting LMZ3 Output Voltage with LM10010/1 Feb. 11, 2014
User guide LMZ31710 Parallel User's Guide Jan. 24, 2014
Application note LMZ31710, LMZ31707, LMZ31704 Parallel Jul. 02, 2013
Application note Powering LMZ3 SIMPLE SWITCHER Power Modules From 3.3 V Jul. 02, 2013
User guide LMZ31710, LMZ31707 and LMZ31704 EVM User's Guide (Rev. A) Jun. 13, 2013

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
49
Description
The Texas Instruments LMZ31704EVM-003 evaluation module (EVM) is a fully assembled and tested circuit for evaluating the LMZ31704 4A Power Module. The EVM operates with an input voltage range of 2.95V to 17V. The output voltage can be selected from four preset values using a jumper (0.6V, 0.9V (...)
Features
  • Jumper selectable output voltage
  • Adjustable Soft Start
  • Adjustable turn-on UVLO
  • Component footprints for user defined programming parts

Design tools & simulation

SIMULATION MODEL Download
SLVM963.ZIP (29 KB) - PSpice Model
SIMULATION MODEL Download
SLVMA15.ZIP (145 KB) - PSpice Model
SIMULATION MODEL Download
SLVMAQ7.ZIP (7 KB) - PSpice Model
SIMULATION TOOL Download
PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)

Reference designs

REFERENCE DESIGNS Download
Xilinx Kintex UltraScale XCKU040 FPGA Power Solution, 6W Reference Design
PMP10630 The PMP10630 reference design is a complete high density power solution for Xilinx® Kintex® UltraScale™ XCKU040 FPGA. This design uses an optimal combination of SIMPLE SWITCHER® modules and LDOs to provide all the necessary voltage rails in a small solution size of 36 x 43 mm (1.4 (...)
document-generic Schematic
REFERENCE DESIGNS Download
Altera® Stratix® V FPGA Power Solution
PMP9365 The PMP9365 reference design provides all the power supply rails necessary to power Altera's Stratix V family of FPGAs.  This design uses several LMZ3 series modules, LDOs, and a DDR termination regulator to provide all the necessary rails to power the FPGA.  It also features two (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
B3QFN (RVQ) 42 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

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