SNVA853C December   2019  – March 2024 LMZ10500 , LMZ10501 , LMZ20501 , LMZ20502 , LMZ21700 , LMZ21701 , LMZ30604 , LMZ31506 , LMZ31520 , LMZ31530 , LMZ31704 , LMZ31707 , LMZ31710 , LMZ34202 , LMZ35003 , LMZ36002 , LMZM23600 , LMZM23601 , LMZM33602 , LMZM33603 , LMZM33604 , LMZM33606 , TLVM13610 , TLVM13630 , TLVM13640 , TLVM13660 , TLVM23615 , TLVM23625 , TPS82085 , TPS82130 , TPSM265R1 , TPSM33615 , TPSM33625 , TPSM365R3 , TPSM365R6 , TPSM53604 , TPSM5601R5 , TPSM5601R5H , TPSM5601R5HE , TPSM560R6 , TPSM63603 , TPSM63604 , TPSM63606 , TPSM63608 , TPSM63610 , TPSM84424 , TPSM84624 , TPSM846C23 , TPSM846C24 , TPSM84824

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Package Types
    1. 2.1 MicroSiP
    2. 2.2 QFN Overmolded
    3. 2.3 QFN Open Frame
    4. 2.4 Leaded
    5. 2.5 QFN-FCMOD
  6. 3Package CAD/CAE Symbols and Footprints
  7. 4Soldering
    1. 4.1 MSL Ratings
    2. 4.2 Reflow Profile
    3. 4.3 Back Side PCB Mounting Considerations
      1. 4.3.1 Method 1 - Solder Surface Perimeter
      2. 4.3.2 Method 2 - Solder Surface Area
      3. 4.3.3 Back Side PCB Mounting Evaluation of TI Modules
      4. 4.3.4 Reflow Fixture
  8. 5Rework During Prototyping
  9. 6References
  10. 7Revision History

Abstract

TI has a large portfolio of power modules offered in different types of packages. This application note offers an overview of several module package types and provides some guidance on soldering topics and considerations.