SNVSCO2 November   2025 LM51261A-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Configuration (CFG-pin)
      2. 6.3.2  Device Enable/Disable (UVLO/EN)
      3. 6.3.3  Dual Device Operation
      4. 6.3.4  Switching Frequency and Synchronization (SYNCIN)
      5. 6.3.5  Dual Random Spread Spectrum (DRSS)
      6. 6.3.6  Operation Modes (BYPASS, DEM, FPWM)
      7. 6.3.7  VCC Regulator, BIAS (BIAS-pin, VCC-pin)
      8. 6.3.8  Soft Start (SS-pin)
      9. 6.3.9  VOUT Programming (VOUT, ATRK, DTRK)
      10. 6.3.10 Protections
        1. 6.3.10.1 VOUT Overvoltage Protection (OVP)
        2. 6.3.10.2 Thermal Shutdown (TSD)
      11. 6.3.11 Fault Indicator (nFAULT-pin)
      12. 6.3.12 Slope Compensation (CSP, CSN)
      13. 6.3.13 Current Sense Setting and Switch Peak Current Limit (CSP, CSN)
      14. 6.3.14 Input Current Limit and Monitoring (ILIM, IMON, DLY)
      15. 6.3.15 Maximum Duty Cycle and Minimum Controllable On-time Limits
      16. 6.3.16 Signal Deglitch Overview
      17. 6.3.17 MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LO, HO, HB-pin)
      18. 6.3.18 I2C Features
        1. 6.3.18.1 Register VOUT (0x0)
        2. 6.3.18.2 Register Configuration 1 (0x1)
        3. 6.3.18.3 Register Configuration 2 (0x2)
        4. 6.3.18.4 Register Configuration 3 (0x3)
        5. 6.3.18.5 Register Operation State (0x4)
        6. 6.3.18.6 Register Status Byte (0x5)
        7. 6.3.18.7 Register Clear Faults (0x6)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown State
    5. 6.5 Programming
      1. 6.5.1 I2C Bus Operation
  8. LM51261A-Q1 Registers
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Feedback Compensation
      2. 8.1.2 3 Phase Operation
      3. 8.1.3 Non-synchronous Application
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Determine the Total Phase Number
        2. 8.2.2.2  Determining the Duty Cycle
        3. 8.2.2.3  Timing Resistor RT
        4. 8.2.2.4  Inductor Selection Lm
        5. 8.2.2.5  Current Sense Resistor Rcs
        6. 8.2.2.6  Current Sense Filter RCSFP, RCSFN, CCS
        7. 8.2.2.7  Low-Side Power Switch QL
        8. 8.2.2.8  High-Side Power Switch QH
        9. 8.2.2.9  Snubber Components
        10. 8.2.2.10 Vout Programming
        11. 8.2.2.11 Input Current Limit (ILIM/IMON)
        12. 8.2.2.12 UVLO Divider
        13. 8.2.2.13 Soft Start
        14. 8.2.2.14 CFG Settings
        15. 8.2.2.15 Output Capacitor Cout
        16. 8.2.2.16 Input Capacitor Cin
        17. 8.2.2.17 Bootstrap Capacitor
        18. 8.2.2.18 VCC Capacitor CVCC
        19. 8.2.2.19 BIAS Capacitor
        20. 8.2.2.20 VOUT Capacitor
        21. 8.2.2.21 Loop Compensation
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Efficiency
        2. 8.2.3.2 Steady State Waveforms
        3. 8.2.3.3 Step Load Response
        4. 8.2.3.4 AC Loop Response Curve
        5. 8.2.3.5 Thermal Performance
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Pin Configuration and Functions

Figure 4-1 LM51261A-Q1 RHB Package, 32-Pin VQFN (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
AGND 4 G Analog ground pin. Connect to the analog ground plane through a wide and short path.
ATRK/DTRK 32 I Output regulation target programming pin. Program the output voltage regulation target by connecting the pin through a resistor to AGND, or by controlling the pin voltage directly with a voltage in the recommended operating range of the pin from 0.2V to 2.0V. A digital PWM signal between 8% to 80% duty cycle is automatically detected at startup and enables the digital output voltage regulation, which programs VOUT in the recommended operating range.
BIAS 18 P Supply voltage input to the VCC regulator. Connect a 1μF local BIAS capacitor from the pin to ground.
CFG 27 I/O

Device configuration pin. Sets the I2C address and enables the 20μA ATRK current.

SCL 26 I/O

I2C clock input-pin.

SDA 25 I/O

I2C data-pin.

COMP 3 O Output of the internal transconductance error amplifier. Connect the loop compensation components between the pin and AGND.
CSN 5 I Current sense amplifier input. The pin operates as the negative input pin.
CSP 6 I Current sense amplifier input. The pin operates as the positive input pin. Supply for the internal undervoltage lockout circuit.
DLY 1 O Average input current limit delay setting pin. A capacitor from DLY to AGND sets the delay from when VIMON reaches 1V until the average input current limit is enabled.
EP - G Exposed pad of the package. Connect the exposed pad to AGND and solder it to a large ground plane to reduce thermal resistance.
GND 23 G Ground pin. Connect to the analog ground plane.
GND 30 G Ground pin. Connect to the analog ground plane.
HB 9 P High-side driver supply for bootstrap gate drive. Boot diode is internally connected from VCC to this pin. Connect a 0.1μF capacitor between the pin and SW.
HO 8 O High-side gate driver output. Connect to the gate of the high-side N-channel MOSFET through a short, low inductance path.
ILIM/IMON 31 O Input current monitor and average input current limit setting pin. Sources a current proportional to the differential current sense voltage. A resistor is connected from this pin to AGND.
LO 11 O Low-side gate driver output. Connect to the gate of the low-side N-channel MOSFET through a short, low inductance path.
MODE 29 I Operation mode selection pin selecting DEM or FPWM.
NC 14 - Non connect pin. Connect this pin to AGND, but it can be also left floating.
NC 15 - Non connect pin. Connect this pin to AGND, but it can be also left floating.
NC 16 - Non connect pin. Connect this pin to AGND, but it can be also left floating.
NC 17 - Non connect pin. Connect this pin to AGND, but it can be also left floating.
NC 20 - Non connect pin. Connect this pin to AGND, but it can be also left floating.
NC 21 - Non connect pin. Connect this pin to AGND, but it can be also left floating.
PGND 13 G Power ground connection pin for low-side gate driver and VCC bias supply.
nFAULT 28 O

nFAULT indicator with open-drain output stage. nFAULT is pulled low when there is a fault condition (see Section 6.3.11). Connect the pin to AGND or leave the pin floating if not in use.

RT 22 I/O Switching frequency setting pin. The switching frequency is programmed by a resistor between the pin and AGND. Switching frequency is dynamically programmable during operation.
SS 2 O Soft start time programming pin. An external capacitor and an internal current source set the ramp rate of the internal error amplifier reference during soft start. The device forces diode emulation during soft start time.
SW 10 I Switching node connection. Connect directly to the source of the high-side N-channel MOSFET.
SYNCIN 24 I External clock synchronization pin. Input for an external clock that overrides the free-running internal oscillator. Connect the SYNCIN pin to ground when it is not used.
UVLO/EN 19 I Undervoltage lockout programming pin. Program the converter start-up and shutdown levels by connecting this pin to the supply voltage through a resistor divider. If greater than VUVLO-RISING, the device is enabled.
VCC 12 P Output of the internal VCC regulator and supply voltage input of the internal MOSFET drivers. Connect a 4.7μF capacitor between the pin and PGND.
VOUT 7 P Output voltage sensing pin. An internal feedback resistor voltage divider is connected from the pin to AGND. Connect a 0.1μF local VOUT capacitor from the pin to ground.
I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.