SNVSCQ8B November   2025  – July 2026 LM654A5-Q1 , LM654B0-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1  Output Voltage Selection
      2. 7.3.2  EN Pin and Use as VIN UVLO
      3. 7.3.3  Device Configuration
      4. 7.3.4  Mode Selection
        1. 7.3.4.1 MODE/SYNC Pin Uses for Synchronization
        2. 7.3.4.2 Clock Locking
      5. 7.3.5  Adjustable Switching Frequency and Phase Shift
      6. 7.3.6  Dual Random Spread Spectrum (DRSS)
      7. 7.3.7  Internal LDO, VCC UVLO, and BIAS Input
      8. 7.3.8  Bootstrap Voltage (BST Pin)
      9. 7.3.9  Soft Start and Recovery From Dropout
      10. 7.3.10 Safety Features
        1. 7.3.10.1 Power-Good Monitor
        2. 7.3.10.2 Overcurrent and Short-Circuit Protection
        3. 7.3.10.3 Hiccup
        4. 7.3.10.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Peak Current Mode Operation
        2. 7.4.2.2 Auto Mode Operation
          1. 7.4.2.2.1 Diode Emulation
        3. 7.4.2.3 FPWM Mode Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Example Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Choosing the Switching Frequency
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitors
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Setting the Output Voltage
        6. 8.2.2.6 Compensation Components
        7. 8.2.2.7 Feed-forward Capacitor (CFF)
        8. 8.2.2.8 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Device Comparison Table

DEVICE ORDERABLE PART NUMBER ENGINEERING PART NUMBER OUTPUT CURRENT TOP-SIDE EXPOSED THERMAL PAD BOTTOM EXPOSED THERMAL PAD PACKAGE JUNCTION TEMPERATURE RANGE
LM654B0-Q1 LM654B0VDARQ1 PLM654B0VDARQ1 20 YES YES VDA (26) –40°C to 150°C
LM654A5-Q1 LM654A5VDARQ1 PLM654A5VDARQ1 15 YES YES VDA (26) –40°C to 150°C
LM654A2-Q1(1) LM654A2VDARQ1 PLM654A2VDARQ1 12 YES YES VDA (26) –40°C to 150°C
LM654A0-Q1(1) LM654A0VDARQ1 PLM654A0VDARQ1 10 YES YES VDA (26) –40°C to 150°C
(1) Preview information (not Production Data)
(1) For all available packages, see the orderable addendum at the end of the data sheet.