SPRSP79D February   2023  – August 2026 TDA4AH-Q1 , TDA4AP-Q1 , TDA4VH-Q1 , TDA4VP-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      11
      2.      12
    3. 5.3 Signal Descriptions
      1.      14
      2. 5.3.1  ADC
        1. 5.3.1.1 MCU Domain
          1.        17
          2.        18
          3.        19
      3. 5.3.2  DDRSS
        1. 5.3.2.1 MAIN Domain
          1.        22
          2.        23
          3.        24
          4.        25
      4. 5.3.3  GPIO
        1. 5.3.3.1 MAIN Domain
          1.        28
        2. 5.3.3.2 WKUP Domain
          1.        30
      5. 5.3.4  I2C
        1. 5.3.4.1 MAIN Domain
          1.        33
          2.        34
          3.        35
          4.        36
          5.        37
          6.        38
          7.        39
        2. 5.3.4.2 MCU Domain
          1.        41
          2.        42
        3. 5.3.4.3 WKUP Domain
          1.        44
      6. 5.3.5  I3C
        1. 5.3.5.1 MCU Domain
          1.        47
      7. 5.3.6  MCAN
        1. 5.3.6.1 MAIN Domain
          1.        50
          2.        51
          3.        52
          4.        53
          5.        54
          6.        55
          7.        56
          8.        57
          9.        58
          10.        59
          11.        60
          12.        61
          13.        62
          14.        63
          15.        64
          16.        65
          17.        66
          18.        67
        2. 5.3.6.2 MCU Domain
          1.        69
          2.        70
      8. 5.3.7  MCSPI
        1. 5.3.7.1 MAIN Domain
          1.        73
          2.        74
          3.        75
          4.        76
          5.        77
          6.        78
          7.        79
        2. 5.3.7.2 MCU Domain
          1.        81
          2.        82
      9. 5.3.8  UART
        1. 5.3.8.1 MAIN Domain
          1.        85
          2.        86
          3.        87
          4.        88
          5.        89
          6.        90
          7.        91
          8.        92
          9.        93
          10.        94
        2. 5.3.8.2 MCU Domain
          1.        96
        3. 5.3.8.3 WKUP Domain
          1.        98
      10. 5.3.9  MDIO
        1. 5.3.9.1 MAIN Domain
          1.        101
          2.        102
        2. 5.3.9.2 MCU Domain
          1.        104
      11. 5.3.10 UFS
        1. 5.3.10.1 MAIN Domain
          1.        107
      12. 5.3.11 CPSW2G
        1. 5.3.11.1 MAIN Domain
          1.        110
        2. 5.3.11.2 MCU Domain
          1.        112
      13. 5.3.12 SGMII
        1. 5.3.12.1 MAIN Domain
          1.        115
      14. 5.3.13 ECAP
        1. 5.3.13.1 MAIN Domain
          1.        118
          2.        119
          3.        120
      15. 5.3.14 EQEP
        1. 5.3.14.1 MAIN Domain
          1.        123
          2.        124
          3.        125
      16. 5.3.15 EPWM
        1. 5.3.15.1 MAIN Domain
          1.        128
          2.        129
          3.        130
          4.        131
          5.        132
          6.        133
          7.        134
      17. 5.3.16 USB
        1. 5.3.16.1 MAIN Domain
          1.        137
      18. 5.3.17 Display Port
        1. 5.3.17.1 MAIN Domain
          1.        140
      19. 5.3.18 PCIE
        1. 5.3.18.1 MAIN Domain
          1.        143
      20. 5.3.19 SERDES
        1. 5.3.19.1 MAIN Domain
          1.        146
          2.        147
          3.        148
          4.        149
      21. 5.3.20 DSI
        1. 5.3.20.1 MAIN Domain
          1.        152
          2.        153
      22. 5.3.21 CSI
        1. 5.3.21.1 MAIN Domain
          1.        156
          2.        157
          3.        158
      23. 5.3.22 MCASP
        1. 5.3.22.1 MAIN Domain
          1.        161
          2.        162
          3.        163
          4.        164
          5.        165
      24. 5.3.23 DMTIMER
        1. 5.3.23.1 MAIN Domain
          1.        168
        2. 5.3.23.2 MCU Domain
          1.        170
      25. 5.3.24 CPTS
        1. 5.3.24.1 MAIN Domain
          1.        173
        2. 5.3.24.2 MCU Domain
          1.        175
      26. 5.3.25 DSS
        1. 5.3.25.1 MAIN Domain
          1.        178
      27. 5.3.26 GPMC
        1. 5.3.26.1 MAIN Domain
          1.        181
      28. 5.3.27 MMC
        1. 5.3.27.1 MAIN Domain
          1.        184
          2.        185
      29. 5.3.28 OSPI
        1. 5.3.28.1 MCU Domain
          1.        188
          2.        189
      30. 5.3.29 Hyperbus
        1. 5.3.29.1 MCU Domain
          1.        192
      31. 5.3.30 Emulation and Debug
        1. 5.3.30.1 MAIN Domain
          1.        195
          2.        196
      32. 5.3.31 System and Miscellaneous
        1. 5.3.31.1 Boot Mode configuration
          1.        199
        2. 5.3.31.2 Clock
          1.        201
          2.        202
        3. 5.3.31.3 System
          1.        204
          2.        205
        4. 5.3.31.4 EFUSE
          1.        207
        5. 5.3.31.5 VMON
          1.        209
      33. 5.3.32 Power
        1.       211
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On-Hour (POH) Limits
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Electrical Characteristics
      1. 6.6.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.6.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 6.6.3  HFOSC/LFOSC Electrical Characteristics
      4. 6.6.4  eMMCPHY Electrical Characteristics
      5. 6.6.5  SDIO Electrical Characteristics
      6. 6.6.6  CSI2/DSI D-PHY Electrical Characteristics
      7. 6.6.7  ADC12B Electrical Characteristics
      8. 6.6.8  LVCMOS Electrical Characteristics
      9. 6.6.9  USB2PHY Electrical Characteristics
      10. 6.6.10 SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
      11. 6.6.11 UFS M-PHY Electrical Characteristics
      12. 6.6.12 eDP/DP AUX-PHY Electrical Characteristics
      13. 6.6.13 DDR0 Electrical Characteristics
    7. 6.7  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8  Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics for ALY Package
    9. 6.9  Temperature Sensor Characteristics
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1 Timing Parameters and Information
      2. 6.10.2 Power Supply Sequencing
        1. 6.10.2.1  Power Supply Slew Rate Requirement
        2. 6.10.2.2  Combined MCU and Main Domains Power- Up Sequencing
        3. 6.10.2.3  Combined MCU and Main Domains Power- Down Sequencing - Option 1
        4. 6.10.2.4  Combined MCU and Main Domains Power- Down Sequencing - Option 2
        5. 6.10.2.5  Isolated MCU and Main Domains Power- Up Sequencing
        6. 6.10.2.6  Isolated MCU and Main Domains Power- Down Sequencing - Option 1
        7. 6.10.2.7  Isolated MCU and Main Domains Power- Down Sequencing - Option 2
        8. 6.10.2.8  Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
        9. 6.10.2.9  Independent MCU and Main Domains, Entry and Exit of DDR Retention State
        10. 6.10.2.10 Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
      3. 6.10.3 System Timing
        1. 6.10.3.1 Reset Timing
        2. 6.10.3.2 Safety Signal Timing
        3. 6.10.3.3 Clock Timing
      4. 6.10.4 Clock Specifications
        1. 6.10.4.1 Input and Output Clocks / Oscillators
          1. 6.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 6.10.4.1.1.1 Load Capacitance
            2. 6.10.4.1.1.2 Shunt Capacitance
          2. 6.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 6.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 6.10.4.1.3.1 Load Capacitance
            2. 6.10.4.1.3.2 Shunt Capacitance
          4. 6.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 6.10.4.1.5 Auxiliary OSC1 Not Used
        2. 6.10.4.2 Output Clocks
        3. 6.10.4.3 PLLs
        4. 6.10.4.4 Module and Peripheral Clocks Frequencies
      5. 6.10.5 Peripherals
        1. 6.10.5.1  ATL
          1. 6.10.5.1.1 ATL_PCLK Timing Requirements
          2. 6.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.10.5.2  CPSW2G
          1. 6.10.5.2.1 CPSW2G MDIO Interface Timings
          2. 6.10.5.2.2 CPSW2G RMII Timings
            1. 6.10.5.2.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 6.10.5.2.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 6.10.5.2.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 6.10.5.2.3 CPSW2G RGMII Timings
            1. 6.10.5.2.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 6.10.5.2.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 6.10.5.2.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 6.10.5.2.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        3. 6.10.5.3  CSI-2
        4. 6.10.5.4  DDRSS
        5. 6.10.5.5  DSS
        6. 6.10.5.6  eCAP
          1. 6.10.5.6.1 Timing Requirements for eCAP
          2. 6.10.5.6.2 Switching Characteristics for eCAP
        7. 6.10.5.7  EPWM
          1. 6.10.5.7.1 Timing Requirements for eHRPWM
          2. 6.10.5.7.2 Switching Characteristics for eHRPWM
        8. 6.10.5.8  eQEP
          1. 6.10.5.8.1 Timing Requirements for eQEP
          2. 6.10.5.8.2 Switching Characteristics for eQEP
        9. 6.10.5.9  GPIO
          1. 6.10.5.9.1 GPIO Timing Requirements
          2. 6.10.5.9.2 GPIO Switching Characteristics
        10. 6.10.5.10 GPMC
          1. 6.10.5.10.1 GPMC and NOR Flash — Synchronous Mode
            1. 6.10.5.10.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 6.10.5.10.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 6.10.5.10.2 GPMC and NOR Flash — Asynchronous Mode
            1. 6.10.5.10.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 6.10.5.10.3 GPMC and NAND Flash — Asynchronous Mode
            1. 6.10.5.10.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 6.10.5.10.4 GPMC0 IOSET
        11. 6.10.5.11 HyperBus
          1. 6.10.5.11.1 Timing Requirements for HyperBus
          2. 6.10.5.11.2 HyperBus 166 MHz Switching Characteristics
          3. 6.10.5.11.3 HyperBus 100 MHz Switching Characteristics
        12. 6.10.5.12 I2C
        13. 6.10.5.13 I3C
        14. 6.10.5.14 MCAN
        15. 6.10.5.15 MCASP
        16. 6.10.5.16 MCSPI
          1. 6.10.5.16.1 MCSPI — Controller Mode
          2. 6.10.5.16.2 MCSPI — Peripheral Mode
        17. 6.10.5.17 MMCSD
          1. 6.10.5.17.1 MMC0 - eMMC Interface
            1. 6.10.5.17.1.1 Legacy SDR Mode
            2. 6.10.5.17.1.2 High Speed SDR Mode
            3. 6.10.5.17.1.3 High Speed DDR Mode
            4. 6.10.5.17.1.4 HS200 Mode
            5. 6.10.5.17.1.5 HS400 Mode
          2. 6.10.5.17.2 MMC1 - SD/SDIO Interface
            1. 6.10.5.17.2.1 Default Speed Mode
            2. 6.10.5.17.2.2 High Speed Mode
            3. 6.10.5.17.2.3 UHS–I SDR12 Mode
            4. 6.10.5.17.2.4 UHS–I SDR25 Mode
            5. 6.10.5.17.2.5 UHS–I SDR50 Mode
            6. 6.10.5.17.2.6 UHS–I DDR50 Mode
            7. 6.10.5.17.2.7 UHS–I SDR104 Mode
        18. 6.10.5.18 CPTS
          1. 6.10.5.18.1 CPTS Timing Requirements
          2. 6.10.5.18.2 CPTS Switching Characteristics
        19. 6.10.5.19 OSPI
          1. 6.10.5.19.1 OSPI0/1 PHY Mode
            1. 6.10.5.19.1.1 OSPI0/1 With PHY Data Training
            2. 6.10.5.19.1.2 OSPI Without Data Training
              1. 6.10.5.19.1.2.1 OSPI Timing Requirements – SDR Mode
              2. 6.10.5.19.1.2.2 OSPI Switching Characteristics – SDR Mode
              3. 6.10.5.19.1.2.3 OSPI Timing Requirements – DDR Mode
              4. 6.10.5.19.1.2.4 OSPI Switching Characteristics – PHY DDR Mode
          2. 6.10.5.19.2 OSPI0/1 Tap Mode
            1. 6.10.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.10.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.10.5.20 OLDI
          1. 6.10.5.20.1 OLDI Switching Characteristics
        21. 6.10.5.21 PCIE
        22. 6.10.5.22 Timers
          1. 6.10.5.22.1 Timing Requirements for Timers
          2. 6.10.5.22.2 Switching Characteristics for Timers
        23. 6.10.5.23 UART
          1. 6.10.5.23.1 Timing Requirements for UART
          2. 6.10.5.23.2 UART Switching Characteristics
        24. 6.10.5.24 USB
      6. 6.10.6 Emulation and Debug
        1. 6.10.6.1 Trace
        2. 6.10.6.2 JTAG
          1. 6.10.6.2.1 JTAG Electrical Data and Timing
            1. 6.10.6.2.1.1 JTAG Timing Requirements
            2. 6.10.6.2.1.2 JTAG Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A72
      2. 7.2.2 Arm Cortex-R5F
      3. 7.2.3 DSP C71x
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 GPU
      2. 7.3.2 VPAC
      3. 7.3.3 DMPAC
    4. 7.4 Other Subsystems
      1. 7.4.1 MSMC
      2. 7.4.2 NAVSS
        1. 7.4.2.1 NAVSS0
        2. 7.4.2.2 MCU_NAVSS
      3. 7.4.3 PDMA Controller
      4. 7.4.4 Power Supply
      5. 7.4.5 Peripherals
        1. 7.4.5.1  ADC
        2. 7.4.5.2  ATL
        3. 7.4.5.3  CSI
          1. 7.4.5.3.1 Camera Streaming Interface Receiver (CSI_RX_IF) and MIPI DPHY Receiver (DPHY_RX)
          2. 7.4.5.3.2 Camera Streaming Interface Transmitter (CSI_TX_IF)
        4. 7.4.5.4  CPSW2G
        5. 7.4.5.5  CPSW9G
        6. 7.4.5.6  DCC
        7. 7.4.5.7  DDRSS
        8. 7.4.5.8  DSS
          1. 7.4.5.8.1 DSI
          2. 7.4.5.8.2 eDP
        9. 7.4.5.9  VPFE
        10. 7.4.5.10 eCAP
        11. 7.4.5.11 EPWM
        12. 7.4.5.12 ELM
        13. 7.4.5.13 ESM
        14. 7.4.5.14 eQEP
        15. 7.4.5.15 GPIO
        16. 7.4.5.16 GPMC
        17. 7.4.5.17 Hyperbus
        18. 7.4.5.18 I2C
        19. 7.4.5.19 I3C
        20. 7.4.5.20 MCAN
        21. 7.4.5.21 MCASP
        22. 7.4.5.22 MCRC Controller
        23. 7.4.5.23 MCSPI
        24. 7.4.5.24 MMC/SD
        25. 7.4.5.25 OSPI
        26. 7.4.5.26 PCIE
        27. 7.4.5.27 SerDes
        28. 7.4.5.28 WWDT
        29. 7.4.5.29 Timers
        30. 7.4.5.30 UART
        31. 7.4.5.31 USB
        32. 7.4.5.32 UFS
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply Decoupling and Bulk Capacitors
        1. 8.1.1.1 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG and EMU
      4. 8.1.4 Reset
      5. 8.1.5 Unused Pins
      6. 8.1.6 Hardware Design Guide for JacintoTM 7 Devices
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 8.2.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal Flash devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines using VMON/POK
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

4.1 Related Products

Automotive driver assist SoCs are safe, scalable, and efficient AI SoCs for entry to premium driving solutions. Vehicles are driving the demand for more AI and safety on the road. The automotive drive assist system-on-a-chip (SoC) family solves the industries toughest problems by bringing highly integrated and efficient AI to see and react quicker powered by next generation C7 digital signal processor (DSP) and NPU architecture. Seamlessly integrate the whole vehicle with a high number of camera and radar connections and a high number of communication interfaces. Automotive drive assist family brings peace of mind to every driver by supporting ISO26262 and safety certifications up to ASIL D.

Software development kit for TDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 and TDA4VH-Q1 Jacinto™ processors The J784S4 processor software development kit (SDK) real-time operating system (RTOS) can be used together with either processor SDK Linux® or processor SDK QNX® to form a multiprocessor software development platform for TDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 and TDA4VH-Q1 system-on-a-chip (SoCs) within our Jacinto™ platform.

PROCESSOR-SDK-J784S4 provides a comprehensive set of software tools and components to help users develop and deploy their applications on supported J784S4 SoCs. The processor SDK RTOS and either processor SDK Linux or processor SDK QNX can be used together to implement various use cases in robotics, vision, factory and building automation, and automotive advanced driver-assistance systems (ADAS).

Products to complete your design:

Please reference the EVM schematics for details of how these devices are implemented in a system design, and bill of materials for specific part number recommendations.