SPRSPC3A February   2026  – August 2026 AM13E23019

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
    2.     Device Package Options
    3. 5.2 AM13E230x Pin Diagrams
    4. 5.3 Pin Attributes
      1. 5.3.1 Pin Attributes Header List
      2.      13
    5. 5.4 Signal Descriptions
      1.      15
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      36.      50
    6. 5.5 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings – Commercial
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Supply Current Characteristics
      1. 6.4.1 RUN/SLEEP Modes
      2. 6.4.2 STOP/STANDBY Modes
      3. 6.4.3 SHUTDOWN Mode
      4. 6.4.4 Reducing Current Consumption
        1. 6.4.4.1 Typical Current Reduction per Disabled Peripheral
    5. 6.5  Electrical Characteristics
    6. 6.6  Digital IO
    7. 6.7  Thermal Information
    8. 6.8  System
      1. 6.8.1 Power Supply Sequencing
        1. 6.8.1.1 Power Supply Ramp
        2. 6.8.1.2 POR and BOR
          1. 6.8.1.2.1 POR and BOR
        3. 6.8.1.3 Timing Characteristics
          1. 6.8.1.3.1 Timing Characteristics
      2. 6.8.2 Clock Module (CKM)
        1. 6.8.2.1 System Oscillator (SYSOSC)
        2. 6.8.2.2 High Frequency Crystal/Clock
        3. 6.8.2.3 System Phase Lock Loop (SYSPLL)
        4. 6.8.2.4 Low Frequency Oscillator (LFOSC)
      3. 6.8.3 Flash Memory Characteristics
        1. 6.8.3.1 Flash Memory Characteristics
      4. 6.8.4 RAM Specifications
      5. 6.8.5 ROM Specifications
    9. 6.9  Analog Peripherals
      1. 6.9.1 Analog-to-Digital Converter (ADC)
        1. 6.9.1.1 ADC Electrical Data and Timing
          1. 6.9.1.1.1 ADC Operating Conditions
          2. 6.9.1.1.2 ADC Characteristics
          3. 6.9.1.1.3 ADC Input Model
            1.         ADC Input Model
          4. 6.9.1.1.4 ADC Timing Requirements
          5. 6.9.1.1.5 External ADC Start-of-Conversion Switching Characteristics
      2. 6.9.2 Comparator Subsystem (CMPSS)
        1. 6.9.2.1 CMPSS Electrical Data and Timing
          1. 6.9.2.1.1 CMPSS_LITE Comparator Electrical Characteristics
          2. 6.9.2.1.2 CMPSS_LITE DAC Static Electrical Characteristics
      3. 6.9.3 Programmable Gain Amplifier (PGA)
        1. 6.9.3.1 PGA Electrical Data and Timing
          1. 6.9.3.1.1 PGA Operating Conditions
          2. 6.9.3.1.2 PGA Characteristics
      4. 6.9.4 Temperature Sensor
        1. 6.9.4.1 Temperature Sensor Electrical Data and Timing
        2. 6.9.4.2 Temperature Sensor Characteristics
      5. 6.9.5 Internal Analog Connections
    10. 6.10 Control Peripherals
      1. 6.10.1 Multichannel Pulse Width Modulator (MCPWM)
      2. 6.10.2 Control Peripherals Synchronization
      3. 6.10.3 MCPWM Electrical Data and Timing
        1. 6.10.3.1 MCPWM Timing Requirements
        2. 6.10.3.2 MCPWM Switching Characteristics
      4. 6.10.4 Enhanced Capture eCAP
      5. 6.10.5 eCAP Block Diagram
      6. 6.10.6 eCAP Synchronization
      7. 6.10.7 eCAP Electrical Data and Timing
        1. 6.10.7.1 eCAP Timing Requirements
        2. 6.10.7.2 eCAP Switching Characteristics
      8. 6.10.8 Enhanced Quadrature Encoder Pulse (eQEP)
      9. 6.10.9 eQEP Electrical Data and Timing
        1. 6.10.9.1 eQEP Timing Requirements
        2. 6.10.9.2 eQEP Switching Characteristics
    11. 6.11 Communication Peripherals
      1. 6.11.1 UNICOMM (UART/I2C/SPI)
        1. 6.11.1.1 Universal Asychronous Receiver/Transmitter (UART)
          1. 6.11.1.1.1 UART Timings and Characteristics
        2. 6.11.1.2 Inter-Integrated Circuit (I2C)
          1. 6.11.1.2.1 I2C Timings and Characteristics
          2. 6.11.1.2.2 I2C Filter Timings
          3. 6.11.1.2.3 I2C Timing Diagram
        3. 6.11.1.3 Serial Peripheral Interface (SPI)
          1. 6.11.1.3.1 SPI Timings and Characteristics
          2. 6.11.1.3.2 SPI Timing Diagram
      2. 6.11.2 Modular Controller Area Network (MCAN)
        1. 6.11.2.1 CAN Timings and Characteristics
    12. 6.12 External Peripheral Interface (EPI)
      1. 6.12.1 EPI SDRAM Interface Switching Characteristics
      2. 6.12.2 EPI SDRAM Timing Diagram
      3. 6.12.3 EPI Host-Bus 8 and Host-Bus 16 Interface Switching Characteristics
      4. 6.12.4 EPI Host-Bus 8 and Host-Bus 16 Interface Timing Requirements
      5. 6.12.5 EPI Host-Bus 8/16 Mode Timing Diagram
      6. 6.12.6 EPI General-Purpose Interface Switching Characteristics
      7. 6.12.7 EPI General-Purpose Interface Timing Requirements
      8. 6.12.8 EPI General-Purpose Mode Timing Diagram
    13. 6.13 Emulation and Debug
      1. 6.13.1 SWD Timing
  8. 7 Detailed Description
    1. 7.1  Overview
    2. 7.2  Memory
      1. 7.2.1 Memory Map
      2. 7.2.2 Peripheral Registers Memory Map
      3. 7.2.3 Static RAM
      4. 7.2.4 Flash Memory
    3. 7.3  Identification
    4. 7.4  Arm Cortex-M33 CPU
      1. 7.4.1 Trigonometric Math Unit (TMU)
      2. 7.4.2 Debug Subsystem
    5. 7.5  TinyEngineTM Neural-network Processing Unit (NPU)
    6. 7.6  DMA
    7. 7.7  Error Aggregator Module (EAM)
    8. 7.8  Power Management and Clock Unit (PMCU)
      1. 7.8.1 Power Management Unit (PMU)
      2. 7.8.2 Operating Modes
        1. 7.8.2.1 Functionality by Operating Mode
      3. 7.8.3 Clock Module (CKM)
    9. 7.9  IOMUX
      1. 7.9.1 Input/Output Diagrams
    10. 7.10 Serial Wire Debug Interface
    11. 7.11 Bootstrap Loader (BSL)
    12. 7.12 Security
      1. 7.12.1 Global Security Controller (GSC)
      2. 7.12.2 AESADV
      3. 7.12.3 Keystore Controller
      4. 7.12.4 CRC Accelerator
    13. 7.13 Timers (TIMx)
    14. 7.14 WWDT
  9. 8 Applications, Implementation, and Layout
    1. 8.1 JTAG and TRACE
    2. 8.2 Schematic
    3. 8.3 Typical Applications
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Device Nomenclature
    3. 9.3 Markings
    4. 9.4 Tools and Software
    5. 9.5 Documentation Support
    6. 9.6 Support Resources
    7. 9.7 Trademarks
    8. 9.8 Electrostatic Discharge Caution
    9. 9.9 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
  13.   PACKAGE OPTION ADDENDUM

Many signals are available on multiple pins, according to the software configuration of the pin multiplexing options.

The following list describes the column headers:

  1. SIGNAL NAME: The name of the signal passing through the pin.
    Note:

    Signal names and descriptions provided in each Signal Descriptions table, represent the pin multiplexed signal function which is implemented at the pin and selected via IOMUX pad configuration registers. Some device subsystems provide secondary multiplexing of signal functions, which are not described in these tables. For more information on secondary multiplexed signal functions, see the respective peripheral chapter of the AM13E230x Microcontrollers Technical Reference Manual..

  2. SIGNAL TYPE: Signal direction and type:

    • I = Input

    • O = Output

    • IO = Input, Output, or simultaneously Input and Output

    • ID = Input with open-drain output function

    • OD = Output, with open-drain output function

    • A = Analog

    • PWR = Power

    • GND = Ground

  3. DESCRIPTION: Description of the signal
  4. BALL: Associated ball number