SWRA814 May   2024 CC1311P3 , CC1311R3 , CC1312R , CC1312R7 , CC1314R10 , CC1352P , CC1352P7 , CC1352R , CC1354P10 , CC1354R10

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2CC131x and CC135x Device Family Comparison
    1. 2.1 Device Naming
      1. 2.1.1 Frequency Band
      2. 2.1.2 Generation, Sub-1GHz and Multi-band
      3. 2.1.3 Protocols
      4. 2.1.4 Major Features
      5. 2.1.5 Radio Output Power
      6. 2.1.6 Memory Size
    2. 2.2 Available RF Outputs
    3. 2.3 Device Package Size
      1. 2.3.1 Pin-to-Pin Compatibility
      2. 2.3.2 Package Size and Reference Design
      3. 2.3.3 Available GPIO Count
    4. 2.4 SMD Component Package Size
    5. 2.5 Crystal Oscillator
      1. 2.5.1 Applications Requiring a Slow Clock Accuracy
      2. 2.5.2 Internal Variable Load Capacitor Array
    6. 2.6 Memory
    7. 2.7 Summary Table
  6. 3Device-to-Device Migration Considerations
    1. 3.1 Sub1-GHz Devices
      1. 3.1.1 Migrating from CC1310 to CC131xRx or CC1311P3
      2. 3.1.2 Migrating from CC1312Rx to CC1311R3 or CC1314R10
      3. 3.1.3 Migrating from CC131xRx to CC1311P3
    2. 3.2 Multi-Band Devices
      1. 3.2.1 Migrating from CC1350 to CC135xRx or CC135xPx
      2. 3.2.2 Migrating from CC1352R to CC1354R10
      3. 3.2.3 Migrating from CC135xRx to CC135xPx
      4. 3.2.4 Migrating from CC1352Px to CC1354P10
  7. 4Summary
  8. 5References
    1. 5.1 Recommended Resources
    2. 5.2 Device Data Sheets

3 Device-to-Device Migration Considerations

The following section provides a summary of specific device-to-device hardware migration considerations, refer to the relevant sections in Section 2 for more detailed information. Major features for each device are noted by the device naming, which is described in Section 2.1.4.

TI recommends referencing the application note, CC13xx/CC26xx Hardware Configuration and PCB Design Considerations, alongside this document. An additional design support resource is TI's E2E™ support forums. Sub-1GHz and Multi-band designs can also be reviewed by a TI engineer for feedback by using the Sub-1GHz Design Review Submission Portal before manufacture.