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CC1354P10

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SimpleLink™ Arm® Cortex®-M33 multiband wireless MCU with EdgeAI support, 1MB + 296KB, +20dBm

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CC1354P10

ACTIVE
Data sheet Order now

Product details

Protocols 6LoWPAN, Amazon Sidewalk, Bluetooth low energy, IEEE 802.15.4, MIOTY, Matter, Proprietary, Thread, Wi-SUN, Wireless M-Bus, Zigbee Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 2360-2500, 287-351, 359-439, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 296 Flash memory (kByte) 1024 CPU Arm® Cortex®-M33 Operating system FreeRTOS, RTOS, TI RTOS Peripherals 12-bit ADC 8-channel, 2 comparators, 4 SPI, 4 UART, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Number of GPIOs 26, 42 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled Edge AI Studio enabled, Yes
Protocols 6LoWPAN, Amazon Sidewalk, Bluetooth low energy, IEEE 802.15.4, MIOTY, Matter, Proprietary, Thread, Wi-SUN, Wireless M-Bus, Zigbee Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 2360-2500, 287-351, 359-439, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 296 Flash memory (kByte) 1024 CPU Arm® Cortex®-M33 Operating system FreeRTOS, RTOS, TI RTOS Peripherals 12-bit ADC 8-channel, 2 comparators, 4 SPI, 4 UART, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Number of GPIOs 26, 42 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled Edge AI Studio enabled, Yes
VQFN (RGZ) 48 49 mm² 7 x 7 VQFN (RSK) 64 64 mm² 8 x 8

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024 kB flash program memory
  • 8 kB of cache SRAM
  • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32 kB of additional SRAM is available if parity is disabled
  • Dual-band Sub-1 GHz and 2.4 GHz operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4 kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.4 mA active mode, CoreMark
    • 71 µA/MHz running CoreMark
    • 0.98 µA standby mode, RTC, 256 kB RAM
    • 0.17 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption
    • 32 µA in 2 MHz mode
    • 849 µA in 24 MHz mode
  • Radio consumption:
    • 5.8 mA RX at 868 MHz
    • 6.9 mA RX at 2.4 GHz
    • 22 mA TX at +10 dBm at 2.4 GHz
    • 25.8 mA TX at +14 dBm at 868 MHz
    • 69 mA TX at +20 dBm at 915 MHz
    • 101 mA TX at +20 dBm at 2.4 GHz

Wireless protocol support

High performance radio

  • Up to 130 dB link budget at 50 kbps, 868 MHz
  • Up to 141 dB link budget at 2.5 kbps, 868 MHz
  • –­121 dBm for 2.5 kbps long-range mode
  • –­110 dBm at 50 kbps, 802.15.4, 868 MHz
  • –104 dBm for Bluetooth® Low Energy 125 kbps
  • –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem)
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 300 328, EN 303 131, EN 303 204, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66, STD-T67 and STD-T108

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200 ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for trusted execution environment
  • AES 128- and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8 V to 3.8 V single supply voltage
  • –40°C to +105°C

Package

  • 7 mm × 7 mm RGZ VQFN48 (26 GPIOs)
  • 8 mm × 8 mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024 kB flash program memory
  • 8 kB of cache SRAM
  • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32 kB of additional SRAM is available if parity is disabled
  • Dual-band Sub-1 GHz and 2.4 GHz operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4 kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.4 mA active mode, CoreMark
    • 71 µA/MHz running CoreMark
    • 0.98 µA standby mode, RTC, 256 kB RAM
    • 0.17 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption
    • 32 µA in 2 MHz mode
    • 849 µA in 24 MHz mode
  • Radio consumption:
    • 5.8 mA RX at 868 MHz
    • 6.9 mA RX at 2.4 GHz
    • 22 mA TX at +10 dBm at 2.4 GHz
    • 25.8 mA TX at +14 dBm at 868 MHz
    • 69 mA TX at +20 dBm at 915 MHz
    • 101 mA TX at +20 dBm at 2.4 GHz

Wireless protocol support

High performance radio

  • Up to 130 dB link budget at 50 kbps, 868 MHz
  • Up to 141 dB link budget at 2.5 kbps, 868 MHz
  • –­121 dBm for 2.5 kbps long-range mode
  • –­110 dBm at 50 kbps, 802.15.4, 868 MHz
  • –104 dBm for Bluetooth® Low Energy 125 kbps
  • –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem)
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 300 328, EN 303 131, EN 303 204, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66, STD-T67 and STD-T108

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200 ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for trusted execution environment
  • AES 128- and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8 V to 3.8 V single supply voltage
  • –40°C to +105°C

Package

  • 7 mm × 7 mm RGZ VQFN48 (26 GPIOs)
  • 8 mm × 8 mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package

The SimpleLink™CC1354P10 device is a multiprotocol and multi-band Sub-1 GHz and 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communications, with advanced security features and on-chip over-the-air (OAD) update capability. It enables long range and reliable communication in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID and trusted functions support.
  • Multi-band device supporting concurrent multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).
  • Enablement of long-range and low-power applications using the integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 64 mA for Sub-1 GHz and 101 mA for 2.4 GHz operation.
  • Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA and +5 dBm at 2.4 GHz with 9.6 mA current consumption.
  • Optimized for coin-cell operation at +10 dBm at 2.4 GHz with 22 mA current consumption.
  • Longer battery life wireless applications with low standby current of 0.98 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5 µA at 85 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1 Hz ADC sampling at 1 µA system current.
  • Low Soft Error Rate (SER) Failure-in-Time (FIT) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1354P10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs Sub-1 GHz solutions, visit www.ti.com/sub1ghz

The SimpleLink™CC1354P10 device is a multiprotocol and multi-band Sub-1 GHz and 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communications, with advanced security features and on-chip over-the-air (OAD) update capability. It enables long range and reliable communication in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID and trusted functions support.
  • Multi-band device supporting concurrent multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).
  • Enablement of long-range and low-power applications using the integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 64 mA for Sub-1 GHz and 101 mA for 2.4 GHz operation.
  • Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA and +5 dBm at 2.4 GHz with 9.6 mA current consumption.
  • Optimized for coin-cell operation at +10 dBm at 2.4 GHz with 22 mA current consumption.
  • Longer battery life wireless applications with low standby current of 0.98 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5 µA at 85 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1 Hz ADC sampling at 1 µA system current.
  • Low Soft Error Rate (SER) Failure-in-Time (FIT) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1354P10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs Sub-1 GHz solutions, visit www.ti.com/sub1ghz

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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU datasheet (Rev. B) 14 Dec 2023
* Errata CC1354P10 SimpleLink Wireless MCU Device Revision B (Rev. B) PDF | HTML 30 Nov 2023
* User guide CC13x4, CC26x4 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 23 Mar 2023
Application note TI Wi-SUN® Network Performance PDF | HTML 01 Aug 2025
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06 Aug 2024
Application note CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 02 May 2024
User guide SimpleLink CC131x and CC135x Family Hardware Migration Guide PDF | HTML 02 May 2024
Certificate LP-EM-CC1354P10-6 EU Declaration of Conformity (DoC) 23 Apr 2024
Application brief Wireless Technologies for Solar Micro Inverters and Trackers (Rev. A) PDF | HTML 09 Apr 2024
Certificate LP-EM-CC1354P10-1 EU Declaration of Conformity (DoC) (Rev. A) 25 Oct 2023
Application note TI 15.4-Stack Software PDF | HTML 17 Oct 2023
Application brief Wireless MCUs Designed to Meet Complex IoT Requirements PDF | HTML 12 Jul 2023
Application note 2.4-GHz, 10-dBm PA IPC for CC26x2P and CC1352P PDF | HTML 05 Apr 2022
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 Mar 2022
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25 Feb 2022
Application note 433 to 930-MHz and 2.4-GHz BOM Tunable PCB Antenna PDF | HTML 07 Feb 2022
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 20 Dec 2021
Application note TI Bluetooth® Mesh Software Product Brief PDF | HTML 17 Dec 2021
Technical article 4 questions to ask before choosing a Wi-SUN stack PDF | HTML 13 Aug 2021
White paper Dynamic Multi-Protocol (DMM) Performance 21 Apr 2021
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 12 Apr 2021
Technical article How Wi-SUN® FAN improves connected infrastructures PDF | HTML 19 Nov 2020
Technical article How TI helps expand connectivity beyond the front door with Amazon Sidewalk PDF | HTML 21 Sep 2020
Application note Finding Settings for New Phy’s for the CC13x0 and CC13x2 Family PDF | HTML 14 Sep 2020
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 May 2020
Application note Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family PDF | HTML 31 Mar 2020
Application note Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 28 Jan 2020
Technical article Designing a building security system with the Sub-1 GHz Linux Gateway Software Dev PDF | HTML 25 Sep 2019
More literature Understanding security features for SimpleLink™ Sub-1 GHz CC13x2 MCUs 17 Jun 2019
More literature Understanding security features for SimpleLink™ Zigbee CC13x2 and CC26x2 Wireles 17 Jun 2019
Application note Bluetooth® Low Energy Tree Structure Network PDF | HTML 29 May 2019
Application note Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs 15 Apr 2019
Technical article The “key” to security: Zigbee 3.0’s security features PDF | HTML 05 Feb 2019
Product overview Out-of-box star-network solution: TI 15.4-Stack 14 Jan 2019
Application note RF PCB Simulation Cookbook 09 Jan 2019
Product overview Time Multiplexing: Concurrent Multi-standard Operation 03 Jan 2019
White paper Migrating your proprietary solution to the SimpleLink™ WMCU 07 Nov 2018
Product overview Electronic Smart Locks: Ultra-low power and Multi-Standard operation 05 Nov 2018
Technical article Unlock every door with the SimpleLink™ platform PDF | HTML 19 Sep 2018
Application note Low-Power ADC Solution for CC13x2 and CC26x2 02 Mar 2018
White paper Thread and Zigbee for home and building automation 01 Mar 2018
Application brief Single-Chip Flow Metering Solution With the CC13x2R Wireless MCUs 27 Feb 2018
Application note Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family 27 Feb 2018
Application note Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 05 Mar 2017
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 Feb 2017

Ordering & quality

Information included:
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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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