TIDUEY6 April   2021

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 C2000 MCU F2838x
      2. 2.3.2 UCC5870-Q1 Gate Driver
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 Hardware Overview
        1. 3.1.1.1 Control Module
          1. 3.1.1.1.1 Control Mother Board
            1. 3.1.1.1.1.1 Inverter Safing - UCC5870 ASC and Fault Control
            2. 3.1.1.1.1.2 DC-DC Safing
            3. 3.1.1.1.1.3 DC-DC Converter Secondary PWM Selection
            4. 3.1.1.1.1.4 Blower Fan Control
            5. 3.1.1.1.1.5 Voltage Monitor
            6. 3.1.1.1.1.6 Resolver Interface Control
            7. 3.1.1.1.1.7 Test Points on Control Module
            8. 3.1.1.1.1.8 General Purpose Ports
            9. 3.1.1.1.1.9 Connectors and Headers on Control Mother Board
          2. 3.1.1.1.2 Power Supplies
            1. 3.1.1.1.2.1 Power Supply 5V /5A
            2. 3.1.1.1.2.2 Power Supply 12-V/1-A
            3. 3.1.1.1.2.3 Power Supply 15-V/0.5-A
          3. 3.1.1.1.3 TCAN4550 module
          4. 3.1.1.1.4 Dual TCAN Module
          5. 3.1.1.1.5 Analog Back End Module
          6. 3.1.1.1.6 Resolver Analog Front End Module
        2. 3.1.1.2 Inverter Module
          1. 3.1.1.2.1 Inverter Mother Board
            1. 3.1.1.2.1.1 Connectors and Headers on Inverter Mother Board
            2. 3.1.1.2.1.2 Jumper and Test Points on Inverter Module
          2. 3.1.1.2.2 Inverter Gate Driver Module
            1. 3.1.1.2.2.1 Inverter Gate Drive Power Supply Module
          3. 3.1.1.2.3 Inverter Current Sense Module
          4. 3.1.1.2.4 Inverter Voltage Sense Module
        3. 3.1.1.3 DC-DC Bidirectional Converter Module
          1. 3.1.1.3.1 DC-DC Converter Mother Board
          2. 3.1.1.3.2 DC-DC Gate Driver Module
    2. 3.2 Resource Mapping
    3. 3.3 Test Setup
    4. 3.4 Test Results
  9. 4General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  10. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
    2. 5.2 Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  11. 6About the Author
3.1.1.2.2 Inverter Gate Driver Module

The gate driver module is built using UCC5870-Q1 isolated gate driver. The UCC5870-Q1 device is a functional safety compliant, isolated, highly configurable single channel gate driver targeted to drive high power SiC MOSFETs and IGBTs in EV/HEV applications. Power transistor protections such as shunt resistor based over-current, NTC based over-temperature, and DESAT detection, including selectable soft turn off or two-level turn off during these faults are available. It is capable of sourcing and sinking 15 A of gate drive current, supporting highly capacitive high current, high voltage power switches and also integrates a 4A active Miller clamp during switching, and an active gate pull-down while the driver lost power. The gate driver operation mode and protection functionality is programmed at power-up via SPI by C2000 MCU. It uses SPI for verification, supervision, and diagnosis as well. Since there is a higher integration of diagnostics and detection functions, it simplifies the design of ISO 26262 ASIL D compliant systems.

The design of gate driver board is based on UCC5870QDWJEVM-026 Evaluation Module User’s Guide. Detailed design information is available in this user guide. Due to the compact form factor of power module, all gate drivers are designed into a single board to optimize the trace lengths while ensuring appropriate and safe spatial distances between each driver stage as shown in Figure 3-22.

GUID-20210303-CA0I-KFG9-LBDP-67M2LMTGVF3N-low.jpg Figure 3-22 UCC5870 Gate Driver Module

Interface to MCU is done through a 3x10 header that links the PWM, SPI signals from MCU to UCC5870s and nFLT signals from UCC5870s to MCU. As the size of gate driver board is restricted, a separate power supply module is designed to cater to isolated power supply requirements of the secondary side of gate drivers. This power supply module is mounted on the rear side of gate driver board on its headers J2, J4, J4_x and two additional headers (J3, J6) for mechanical support to make the gate driver module.

The gate driver module is mounted on inverter mother board socket headers J1, J3, J6, J10, J13, J15, J18 and J19.