TIDUEY6 April   2021

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 C2000 MCU F2838x
      2. 2.3.2 UCC5870-Q1 Gate Driver
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 Hardware Overview
        1. 3.1.1.1 Control Module
          1. 3.1.1.1.1 Control Mother Board
            1. 3.1.1.1.1.1 Inverter Safing - UCC5870 ASC and Fault Control
            2. 3.1.1.1.1.2 DC-DC Safing
            3. 3.1.1.1.1.3 DC-DC Converter Secondary PWM Selection
            4. 3.1.1.1.1.4 Blower Fan Control
            5. 3.1.1.1.1.5 Voltage Monitor
            6. 3.1.1.1.1.6 Resolver Interface Control
            7. 3.1.1.1.1.7 Test Points on Control Module
            8. 3.1.1.1.1.8 General Purpose Ports
            9. 3.1.1.1.1.9 Connectors and Headers on Control Mother Board
          2. 3.1.1.1.2 Power Supplies
            1. 3.1.1.1.2.1 Power Supply 5V /5A
            2. 3.1.1.1.2.2 Power Supply 12-V/1-A
            3. 3.1.1.1.2.3 Power Supply 15-V/0.5-A
          3. 3.1.1.1.3 TCAN4550 module
          4. 3.1.1.1.4 Dual TCAN Module
          5. 3.1.1.1.5 Analog Back End Module
          6. 3.1.1.1.6 Resolver Analog Front End Module
        2. 3.1.1.2 Inverter Module
          1. 3.1.1.2.1 Inverter Mother Board
            1. 3.1.1.2.1.1 Connectors and Headers on Inverter Mother Board
            2. 3.1.1.2.1.2 Jumper and Test Points on Inverter Module
          2. 3.1.1.2.2 Inverter Gate Driver Module
            1. 3.1.1.2.2.1 Inverter Gate Drive Power Supply Module
          3. 3.1.1.2.3 Inverter Current Sense Module
          4. 3.1.1.2.4 Inverter Voltage Sense Module
        3. 3.1.1.3 DC-DC Bidirectional Converter Module
          1. 3.1.1.3.1 DC-DC Converter Mother Board
          2. 3.1.1.3.2 DC-DC Gate Driver Module
    2. 3.2 Resource Mapping
    3. 3.3 Test Setup
    4. 3.4 Test Results
  9. 4General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  10. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
    2. 5.2 Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  11. 6About the Author
3.1.1.2.1 Inverter Mother Board

Inverter mother board is the host board in inverter module. It consists of a 3-phase SiC inverter module rated at 1200V/ 50A, a heat-sink and a blower fan for thermal dissipation. Certain functions of the inverter module are realized on separate daughter cards or sub modules that would plug into inverter mother board. This helps with easy debugging and to easily replace modules in case of error or if improvements are needed. It has various connectors to connect to the control module and various sub modules. Besides it has appropriate PCB terminations for mounting high power lugs to feed in high power DC and to draw high power inverter output to motor. Here below is the list of modules it supports

  1. UCC5870 ASIL-D Gate Driver Module
  2. Voltage Sense Module
  3. Current Sense Module

The inverter mother board is shown in Figure 3-21.

GUID-20210303-CA0I-0CTN-MDKC-33TDGKR27HP9-low.jpg Figure 3-21 Inverter Mother Board

The inverter mother board is fabricated with 2-oz copper on either side and high current traces / planes are parallel routed on either sides to give a 4oz effective thickness. Its connectors J17, J21 and J22 will mate with control mother board headers J3, J4 and J6 to receive control signals and send feedback signals.