TIDUF27A February   2025  – March 2025 AMC131M03 , MSPM0G1507

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
    2. 1.2 End Equipment
    3. 1.3 Electricity Meter
    4. 1.4 Power Quality Meter, Power Quality Analyzer
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Voltage Measurement Analog Front End
      2. 2.2.2 Analog Front End for Current Measurement
      3. 2.2.3 XDS110 Emulator
      4. 2.2.4 Bluetooth® Data Transmission
      5. 2.2.5 Bluetooth® Connection Between Two Modules
      6. 2.2.6 Bluetooth® to UART Connection
      7. 2.2.7 Magnetic Tamper Detection With TMAG5273 Linear 3D Hall-Effect Sensor
    3. 2.3 Highlighted Products
      1. 2.3.1  MSPM0G3507
      2. 2.3.2  AMC131M03
      3. 2.3.3  CDC6C
      4. 2.3.4  RES60A-Q1
      5. 2.3.5  TPS3702
      6. 2.3.6  TPD4E05U06
      7. 2.3.7  ISOUSB111
      8. 2.3.8  LMK1C1104
      9. 2.3.9  MSP432E401Y
      10. 2.3.10 TPS709
      11. 2.3.11 TMAG5273
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 Clocking System
        1. 3.1.1.1 BAW Oscillator
        2. 3.1.1.2 Crystal Oscillator
        3. 3.1.1.3 PWM
        4. 3.1.1.4 Clock Buffers
      2. 3.1.2 SPI Bus Configuration
      3. 3.1.3 Jumper Settings for LED and UART
    2. 3.2 Software Requirements
      1. 3.2.1 UART for PC GUI Communication
      2. 3.2.2 Direct Memory Access (DMA)
      3. 3.2.3 ADC Setup
      4. 3.2.4 Calibration
    3. 3.3 Test Setup
      1. 3.3.1 Connections to the Test Setup
      2. 3.3.2 Power Supply Options and Jumper Settings
        1.       51
      3. 3.3.3 Cautions and Warnings
    4. 3.4 Test Results
      1. 3.4.1 Electricity Meter Metrology Accuracy Results
      2. 3.4.2 Radiated Emissions Performance
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Layout Prints
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author
  12. 6Revision History

4.1.3 PCB Layout Recommendations

For this design, follow these general guidelines:

  • Place decoupling capacitors close to the associated pins.
  • Use ground planes instead of ground traces and minimize the cuts in the ground plane, especially near the AMC131M03. In this design, there is a ground plane on both the top and bottom layer; for this situation, make sure that there is good stitching between the planes through the liberal use of vias.
  • Keep the two differential traces to the inputs of an ADC channel symmetrical and as close as possible to each other.
  • For the AMC131M03 devices, place the 0.1μF capacitor closer to the AVDD pin than the 1μF capacitor. Do the same thing for the 0.1μF and 1μF capacitors connected to DVDD.
  • Minimize the length of the traces used to connect the crystal to the microcontroller. Place guard rings around the leads of the crystal and ground the crystal housing. In addition, there must be clean ground underneath the crystal oscillator (XTAL) or the BAW device, so placing any traces underneath must be avoided. Also, keep high-frequency signals away from the clocking island for the MSPM0G3507.
  • Use wide traces for power-supply connections.
  • Make sure that the recommended clearance and creepage spacing are met for the AMC131M03 and ISOUSB111 isolation devices in this design.