TIDUF72 August   2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
    2. 1.2 End Equipment
    3. 1.3 Electricity Meter
    4. 1.4 Power Quality Meter, Power Quality Analyzer
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Magnetic Tamper Detection With TMAG5273 Linear 3D Hall-Effect Sensor
      2. 2.2.2 Analog Inputs of Standalone ADCs
      3. 2.2.3 Voltage Measurement Analog Front End
      4. 2.2.4 Analog Front End for Current Measurement
    3. 2.3 Highlighted Products
      1. 2.3.1 AMC131M03
      2. 2.3.2 ADS131M02
      3. 2.3.3 MSPM0G1106
      4. 2.3.4 TMAG5273
      5. 2.3.5 ISO6731
      6. 2.3.6 TRS3232E
      7. 2.3.7 TPS709
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1  Software Requirements
      2. 3.1.2  UART for PC GUI Communication
      3. 3.1.3  Direct Memory Access (DMA)
      4. 3.1.4  ADC Setup
      5. 3.1.5  Foreground Process
      6. 3.1.6  Formulas
        1. 3.1.6.1 Standard Metrology Parameters
        2. 3.1.6.2 Power Quality Formulas
      7. 3.1.7  Background Process
      8. 3.1.8  Software Function per_sample_dsp()
      9. 3.1.9  Voltage and Current Signals
      10. 3.1.10 Pure Waveform Samples
      11. 3.1.11 Frequency Measurement and Cycle Tracking
      12. 3.1.12 LED Pulse Generation
      13. 3.1.13 Phase Compensation
    2. 3.2 Test Setup
      1. 3.2.1 Power Supply Options and Jumper Setting
      2. 3.2.2 Electricity Meter Metrology Accuracy Testing
      3. 3.2.3 Viewing Metrology Readings and Calibration
        1. 3.2.3.1 Calibrating and Viewing Results From PC
      4. 3.2.4 Calibration and FLASH Settings for MSPM0+ MCU
      5. 3.2.5 Gain Calibration
      6. 3.2.6 Voltage and Current Gain Calibration
      7. 3.2.7 Active Power Gain Calibration
      8. 3.2.8 Offset Calibration
      9. 3.2.9 Phase Calibration
    3. 3.3 Test Results
      1. 3.3.1 Energy Metrology Accuracy Results
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
      4. 4.1.4 Layout Prints
      5. 4.1.5 Altium Project
      6. 4.1.6 Gerber Files
      7. 4.1.7 Assembly Drawings
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Authors

4.1.3 PCB Layout Recommendations

For this design, follow these general guidelines:

  • Place decoupling capacitors close to the associated pins.
  • Use ground planes instead of ground traces and minimize the cuts in the ground plane, especially near the ADS131M02 and AMC131M03. In this design, there is a ground plane on both the top and bottom layer for the HGND (high voltage side) for both Phase A and Phase B. Make sure that there is good stitching between the planes through the liberal use of vias.
  • Keep the two traces to the inputs of each ADC channel symmetrical and as close as possible to each other.
  • Crosstalk from the voltage to current channels can reduce accuracy at lower currents if power offset is not performed.
  • For the ADS131M02 and AMC131M03 devices, place the 0.1μF capacitor closer to the AVDD pin than the 1μF capacitor. Do the same thing for the 0.1μF and 1μF capacitors connected to DVDD.
  • Minimize the length of the traces used to connect the crystal to the microcontroller. Place guard rings around the leads of the crystal and ground the crystal housing. In addition, there must be clean ground underneath the crystal and avoid placing any traces underneath the crystal. Also, keep high-frequency signals away from the crystal.
  • Use wide traces for power-supply connections.
  • Use a different ground plane for the isolated RS-232. This other ground plane is at the potential of the RS-232 ground and not the GND used elsewhere in the board.
  • Make sure that the recommended clearance and creepage spacing are met for the ISO6731 isolation device.