SNAS826A April   2022  – July 2022 LMK6C

ADVANCE INFORMATION  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Environmental Compliance
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Thermal Information
    7. 7.7 Electrical Characteristics
    8. 7.8 Timing Diagrams
  8. 8 Parameter Measurement Information
    1. 8.1 Device Output Configurations
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bulk Acoustic Wave (BAW)
      2. 9.3.2 Device Block-Level Description
      3. 9.3.3 Function Pin(s)
      4. 9.3.4 Clock Output Interfacing and Termination
      5. 9.3.5 Temperature Stability
      6. 9.3.6 Mechanical Robustness
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Ensuring Thermal Reliability
      2. 12.1.2 Best Practices for Signal Integrity
      3. 12.1.3 Recommended Solder Reflow Profile
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Device Nomenclature
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Packaging Information
    2. 14.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DLE|4
  • DLF|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Differential and single-ended output, any frequency within the given range can be supported:
    • LMK6P: LVPECL output, 1 – 400 MHz
    • LMK6D: LVDS output, 1 – 400 MHz
    • LMK6H: HCSL output, 1 – 400 MHz
    • LMK6C: LVCMOS output, 1 – 200 MHz
  • Ultra-low jitter:
    • LMK6P/LMK6D/LMK6H: 100-fs RMS jitter, Fout ≥ 100 MHz
    • LMK6C: 300-fs RMS jitter, Fout ≥ 25 MHz
    • LMK6H: PCIe Gen 1-6 compliant
  • ±25-ppm total frequency stability inclusive of all factors and 10 year aging
  • Smallest industry standard package: 2.50 mm × 2.00 mm (DLF)
    • 3.20 mm × 2.50 mm (DLE) also available
  • Support extended industrial temperature grade:
    • LMK6P/LMK6D/LMK6H: –40°C to 85°C
    • LMK6C: –40°C to 105°C
  • Integrated LDO for robust supply noise immunity
  • < 5-ms start-up time
  • Fixed-frequency devices, programmed at the factory. Short leadtime on new frequencies for sampling. Contact TI representative.