Gallium nitride (GaN) power devices
Maximize power density and reliability with our portfolio of GaN power devices for every power level
Our family of gallium nitride (GaN)FETs with integrated gate drivers and GaN power devices offer the most efficient GaN solution with lifetime reliability and cost advantages. GaN transistors can switch much faster than silicon MOSFETs which offers the potential to achieve lower switching losses. Our GaN transistors are being adopted for a wide range of applications from telecommunications, servers, motor drives, laptop adapters and on-board chargers for electric vehicles.
GaN’s inherent lower gate and output capacitance enables a MHz switching frequency operation which reduces gate and switching losses to increase efficiency.
GaN’s integrated driver enables switching speeds of >150 V/ns, resulting in half the losses compared to discrete GaN FETs. This, combined with our low-inductance package, delivers clean switching and minimal ringing in every power application.
TI GaN-on-silicon process utilizes our 100% internal manufacturing facilities for fabrication, assembly and test, thus leveraging internally-owned capacity and maximized product quality.
Power management is at the center of enabling the continued integration of electronics in our lives. For decades, TI has been at the forefront of developing new process, packaging and circuit-design technologies to deliver the best power devices for your design. Check out our featured GaN devices below, designed to help you address power density.
GaN FETs with integrated driver & protection for power density
GaN FETs have inherently superior performance over traditional silicon FETs, which is enabling engineers to push the boundary in power designs and reach new levels of power density and efficiency. From consumer applications such as AC/DC power supplies all the way up to multi-kW, three-phase converters – GaN is reducing the weight, size and cost of these power designs while also reducing energy consumption. GaN’s high-speed switching is changing the way power systems look today, enabling market trends such as ultra-thin power supplies, motor drive integrated robotics and achieving >200% more power density in next-generation datacenters and 5G rectifiers.
Featured gallium nitride (GaN) reference designs
This reference design provides a design template for implementing a three-level, three-phase, silicon carbide/gallium nitride (SiC/GaN) based ANPC inverter power stage.
This design demos a robust PFC solution, which avoids isolated current sense by putting the controller's ground in the middle of a MOS
This reference design is a 3.-kW bidirectional interleaved continuous conduction mode (CCM) totem-pole (TTPL) bridgeless power factor correction (PFC) power stage using a C2000™ real-time controller and LMG3410R070 gallium nitride (GaN) with integrated driver and protection.
TI’s new automotive GaN FETs can help reduce the size of electric vehicle (EV) onboard chargers and DC/DC converters by as much as 50% compared to existing Si or SiC solutions, offering electric vehicles an extended battery range with increased system reliability at a lower design cost.
Our GaN FETs feature:
- A fast switching, 2.2-MHz integrated gate driver
- Twice the power density to achieve 99% efficiency
- A 59% reduction in the size of power magnetics compared to existing solutions
View the LMG3522R030-Q1 to learn more.
The most efficient & reliable GaN
TI's integrated approach to GaN offers ease of design with a compact single-chip solution, high efficiency as a result of optimized gate drive layout and high reliability with integrated overcurrent protection and 40 million hours of device reliability hours. With devices from 150-mΩ to 30-mΩ, we have a GaN solution for every application.