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Product details

Parameters

Configuration 8:1 Number of channels (#) 1 Power supply voltage - single (V) 3.3, 5, 12, 16, 20 Ron (Typ) (Ohms) 125 ON-state leakage current (Max) (µA) 0.3 Bandwidth (MHz) 20 Operating temperature range (C) -55 to 125 Features Break-before-make Input/output continuous current (Max) (mA) 10 Rating Catalog CON (Typ) (pF) 30 Supply current (Typ) (uA) 0.04 open-in-new Find other Analog switches/muxes

Package | Pins | Size

PDIP (N) 16 181 mm² 19.3 x 9.4 SOIC (D) 16 59 mm² 9.9 x 6 SOP (NS) 16 80 mm² 10.2 x 7.8 TSSOP (PW) 16 22 mm² 4.4 x 5 TSSOP (PW) 16 22 mm² 5 x 4.4 open-in-new Find other Analog switches/muxes

Features

  • Wide Range of Digital and Analog Signal Levels
    • Digital: 3 V to 20 V
    • Analog: ≤ 20 VP-P
  • Low ON Resistance, 125 Ω (Typical) Over 15 VP-P Signal Input Range for VDD – VEE = 18 V
  • High OFF Resistance, Channel Leakage of
    ±100 pA (Typical) at VDD – VEE = 18 V
  • Logic-Level Conversion for Digital Addressing Signals of 3 V to 20 V (VDD – VSS = 3 V to 20 V) to Switch Analog Signals to 20 VP-P (VDD – VEE = 20 V) Matched Switch Characteristics, rON = 5 Ω (Typical) for VDD – VEE = 15 V Very Low Quiescent Power Dissipation Under All Digital-Control Input and Supply Conditions, 0.2 µW (Typical) at
    VDD – VSS = VDD – VEE = 10 V
  • Binary Address Decoding on Chip
  • 5 V, 10 V, and 15 V Parametric Ratings
  • 100% Tested for Quiescent Current at 20 V
  • Maximum Input Current of 1 µA at 18 V Over Full Package Temperature Range, 100 nA at 18 V and 25°C
  • Break-Before-Make Switching Eliminates Channel Overlap

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Description

The CD405xB analog multiplexers and demultiplexers are digitally-controlled analog switches having low ON impedance and very low OFF leakage current. These multiplexer circuits dissipate extremely low quiescent power over the full VDD – VSS and VDD – VEE supply-voltage ranges, independent of the logic state of the control signals.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 11
Type Title Date
* Datasheet CD405xB CMOS Single 8-Channel Analog Multiplexer/Demultiplexer with Logic-Level Conversion datasheet (Rev. I) Aug. 31, 2017
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guides Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics Dec. 03, 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


CAD/CAE symbols

Package Pins Download
PDIP (N) 16 View options
SO (NS) 16 View options
SOIC (D) 16 View options
TSSOP (PW) 16 View options

Ordering & quality

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