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Product details

Parameters

Technology Family CD4000 Bits (#) 6 Vout (Min) (V) 5 Vout (Max) (V) 18 IOH (Max) (mA) -6.8 IOL (Max) (mA) 6.8 Rating Catalog open-in-new Find other Unidirectional voltage translators

Package | Pins | Size

PDIP (N) 16 181 mm² 19.3 x 9.4 SOIC (D) 16 59 mm² 9.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 open-in-new Find other Unidirectional voltage translators

Features

  • Independence of power-supply sequence considerations - VCC can exceed VDD; input signals can exceed both VCC and VDD
  • Up and down level-shifting capability
  • Shiftable input threshold for either CMOS or TTL compatibility
  • Standardized symmetrical output characteristics
  • 100% tested for quiescent current @ 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • 5V, 10 V, and 15 V parametric ratings
  • Meets all requirements of JEDEC Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor.

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Description

CD4504B hex voltage level-shifter consists of six circuits which shift input signals from the VCC logic level to the VDD logic level. To shift TTL signals to CMOS logic levels, the SELECT input is at the VCC HIGH logic state. When the SELECT input is a LOW logic state, each circuit translates signals from one CMOS level to another.

The CD4504B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, and MT suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

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Technical documentation

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Type Title Date
* Data sheet CD4504B TYPES datasheet (Rev. D) Nov. 09, 2004
Selection guide Voltage Translation Buying Guide (Rev. A) Apr. 15, 2021
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics Dec. 03, 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

CAD/CAE symbols

Package Pins Download
PDIP (N) 16 View options
SOIC (D) 16 View options
TSSOP (PW) 16 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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