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Product details

Parameters

VDS (V) 20 Power loss (W) 1.8 Ploss current (A) 12 Configuration PowerStage ID, continuous drain current at Ta=25degC (A) 20 Package (mm) SON3x3 PowerStage Operating temperature range (C) -40 to 150 open-in-new Find other Power stages

Features

  • 92.5% System Efficiency at 12 A
  • Ultra-Low Power Loss of 1.8 W at 12 A
  • Max Rated Continuous Current of 20 A and Peak Current of 45 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.3-mm × 3.3-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Low Quiescent (LQ) and Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
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Description

The CSD95379Q3M NexFET™ power stage is a highly optimized design for use in high-power, high-density synchronous buck converters. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces high-current, high-efficiency, and high-speed switching capability in a small 3.3-mm × 3.3-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet CSD95379Q3M Synchronous Buck NexFET Power Stage datasheet (Rev. D) Dec. 30, 2016
Technical articles Understanding the benefits of “lead-free” power MOSFETs Feb. 07, 2019
Technical articles When to use load switches in place of discrete MOSFETs Feb. 03, 2016
Technical articles 48V systems: Driving power MOSFETs efficiently and robustly Oct. 08, 2015
Technical articles How to create a power supply for Intel’s Braswell processor Aug. 10, 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Design tools & simulation

SIMULATION MODEL Download
SLPM112.ZIP (17 KB) - PSpice Model
SIMULATION MODEL Download
SLPM310.ZIP (43 KB) - TINA-TI Spice Model
SIMULATION MODEL Download
SLPM311.TSC (2606 KB) - TINA-TI Reference Design

Reference designs

REFERENCE DESIGNS Download
Switched capacitor integrated buck (SCIB) power converter reference design
PMP22510 — This switched capacitor integrated buck (SCIB) converter is a highly-optimized design for use in a high-power, high-density single output power converter, operating from a wide-range 40-V to 60-V input rail to produce a 8.0-V, 5.0-V, 3.3-V or 1.8-V rail up to 40A of load current each phase. This (...)
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CAD/CAE symbols

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