Product details

VDS (V) 30 Power loss (W) 2.2 Ploss current (A) 12 Configuration PowerStage ID - continuous drain current at Ta=25degC (A) 20 Package (mm) QFN 3.5 x 4.5 proprietary footprint Operating temperature range (C) -40 to 150
VDS (V) 30 Power loss (W) 2.2 Ploss current (A) 12 Configuration PowerStage ID - continuous drain current at Ta=25degC (A) 20 Package (mm) QFN 3.5 x 4.5 proprietary footprint Operating temperature range (C) -40 to 150
  • 90% System Efficiency at 15 A
  • Max Rated Continuous Current 20 A, Peak 45 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootsrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free
  • 90% System Efficiency at 15 A
  • Max Rated Continuous Current 20 A, Peak 45 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootsrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free

The CSD97394Q4M NexFET™ Power Stage is a highly-optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

The CSD97394Q4M NexFET™ Power Stage is a highly-optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

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Technical documentation

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Type Title Date
* Data sheet CSD97394Q4M Synchronous Buck NexFET Power Stage datasheet 21 Jan 2015
Technical article Understanding the benefits of “lead-free” power MOSFETs 08 Feb 2019
Technical article When to use load switches in place of discrete MOSFETs 03 Feb 2016
Technical article 48V systems: Driving power MOSFETs efficiently and robustly 08 Oct 2015

Design & development

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Simulation model

CSD97394Q4M PSpice Transient Model

SLPM274.ZIP (55 KB) - PSpice Model
Simulation model

CSD97394Q4M TINA-TI Reference Design

SLPM281.TSC (366 KB) - TINA-TI Reference Design
Simulation model

CSD97394Q4M TINA-TI Transient Spice Model

SLPM282.ZIP (50 KB) - TINA-TI Spice Model
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