The LMV1031 audio amplifier is an ideal replacement for the JFET preamplifier that is
currently used in the electret microphones. The LMV1031 is optimized for applications that require
extended battery life, such as Bluetooth communication links. The supply current for the LMV1031 is
only 72 μA. This is a dramatic reduction from that required for a JFET equipped microphone. The
LMV1031, with its separate output and supply pins, offers a higher PSRR and eliminates the need for
additional external components.
The LMV1031 is ensured to operate from 2V to 5V supply voltage over the full temperature
range, has a fixed voltage gain of 20 dB and enhanced SNR performance. The LMV1031 is optimized for
an output biasing of 1.09V.
The LMV1031 has less than 200Ω of output impedance over the full audio bandwidth. The
gain response of the LMV1031 is flat within the audio band and is stable over the temperature
range.
The LMV1031 is available in a large dome 4-bump ultra thin DSBGA package that can easily
fit on the PCB inside the miniature microphone metal can (package). This package is designed for
microphone PCBs requiring 1 kg adhesion criteria.
The LMV1031 audio amplifier is an ideal replacement for the JFET preamplifier that is
currently used in the electret microphones. The LMV1031 is optimized for applications that require
extended battery life, such as Bluetooth communication links. The supply current for the LMV1031 is
only 72 μA. This is a dramatic reduction from that required for a JFET equipped microphone. The
LMV1031, with its separate output and supply pins, offers a higher PSRR and eliminates the need for
additional external components.
The LMV1031 is ensured to operate from 2V to 5V supply voltage over the full temperature
range, has a fixed voltage gain of 20 dB and enhanced SNR performance. The LMV1031 is optimized for
an output biasing of 1.09V.
The LMV1031 has less than 200Ω of output impedance over the full audio bandwidth. The
gain response of the LMV1031 is flat within the audio band and is stable over the temperature
range.
The LMV1031 is available in a large dome 4-bump ultra thin DSBGA package that can easily
fit on the PCB inside the miniature microphone metal can (package). This package is designed for
microphone PCBs requiring 1 kg adhesion criteria.