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Product details

Parameters

Technology Family LSF Application I2C Bits (#) 2 High input voltage (Min) (Vih) 0.9 High input voltage (Max) (Vih) 5.5 Output voltage (Max) (V) 5.5 Output voltage (Min) (V) 0.9 IOH (Max) (mA) 0 IOL (Max) (mA) 0 Rating Automotive open-in-new Find other Auto bidirectional voltage translators

Package | Pins | Size

VSSOP (DCU) 8 6 mm² 2 x 3.1 open-in-new Find other Auto bidirectional voltage translators

Features

  • AEC-Q100 Qualified for Automotive Applications
    • Temperature Grade 1: –40°C ≤ TA ≤ 125°C
    • Device HBM ESD Classification Level 2
    • CDM ESD Classification Level C6
  • Provides Bidirectional Voltage Translation With No Direction Pin
  • Supports open drain and push-pull applications such as I2C, SPI, UART, MDIO, SDIO, and GPIO
  • Supports Up to 100 MHz Up Translation and Greater Than 100 MHz Down Translation at
    ≤ 30pF Cap Load and Up To 40 MHz Up/Down Translation at 50 pF Cap Load
  • Enables Bidirectional Voltage Level Translation Between
    • 0.95 V ↔ 1.8/2.5/3.3/5 V
    • 1.2 V ↔ 1.8/2.5/3.3/5 V
    • 1.8 V ↔ 2.5/3.3/5 V
    • 2.5 V ↔ 3.3/5 V
    • 3.3 V ↔ 5 V
  • Low Standby Current
  • 5 V Tolerant I/O Ports to Support TTL
    Voltage Levels
  • Low ron Provides Less Signal Distortion
  • High-Impedance I/O pins when EN = Low
  • Flow-Through Pinout for Ease of PCB Trace Routing
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

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open-in-new Find other Auto bidirectional voltage translators

Description

The LSF0102-Q1 device is an auto bidirectional voltage translator that translates among a wide range of supplies without the need for a directional pin. The LSF0102-Q1 supports up to 100 MHz up translation and greater than 100 MHz down translation with capacitive loads ≤ 30 pF. Additionally, the LSF0102-Q1 supports up to 40 MHz up and down translation at 50 pF capacitance load, which enables the LSF0102-Q1 device to support a wide variety of standard interfaces commonly found in automotive applications such as I2C, SPI, GPIO, SDIO, UART, and MDIO.

The LSF0102-Q1 device has 5-V tolerant data inputs. This makes the device compatible with TTL voltage levels. Furthermore, the LSF0102-Q1 supports mixed-mode voltage translation, allowing the device to up translate and down translate to different supply levels on each channel.

open-in-new Find other Auto bidirectional voltage translators
Download

Technical documentation

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Type Title Date
* Datasheet LSF0102-Q1 Automotive 2-Channel Auto Bidirectional Multi-Voltage Level Translator datasheet May 08, 2018
Solution guides Voltage translation buying guide Jun. 13, 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
$10.00
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
EVALUATION BOARDS Download
document-generic User guide
$20.00
Description

The LSF family of devices are level translators that support a voltage range of 0.95V and 5V and provide multi-voltage bidirectional translation without a direction pin.

The LSF-EVM comes populated with the LSF0108PWR device and has landing patterns that are compatible with the LSF0101DRYR (...)

Features
  • Supports all devices in the LSF family of level translators (LSF0101, LSF0102, LSF0204, LSF0108)
  • Layout optimized for high speed operation (up to 100 MHz up translation and greater than 100 MHz down translation)
  • Includes various connection interfaces including edge-mount SMB and differential probe (...)
INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODELS Download
SDLM023.ZIP (56 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
VSSOP (DCU) 8 View options

Ordering & quality

Support & training

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