SN74AUC2G53

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2.5-V, 2:1 (SPDT), 1-channel general-purpose analog switch

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 1 Power supply voltage - single (V) 0.8, 1.2, 1.8, 2.5 Ron (Typ) (Ohms) 6 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 85 Input/output continuous current (Max) (mA) 50 Rating Catalog CON (Typ) (pF) 9 open-in-new Find other Analog switches & muxes

Package | Pins | Size

DSBGA (YZP) 8 3 mm² .928 x 1.928 SSOP (DCT) 8 8 mm² 2.95 x 2.80 VSSOP (DCU) 8 6 mm² 2 x 3.1 open-in-new Find other Analog switches & muxes

Features

  • Available in the Texas Instruments NanoFree™ Package
  • Operates at 0.8 V to 2.7 V
  • Sub-1-V Operable
  • Low Power Consumption, 10 µA at 2.7 V
  • High On-Off Output Voltage Ratio
  • High Degree of Linearity
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree Is a trademark of Texas Instruments.

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Description

This analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.1-V to 2.7-V VCC operation.

The SN74AUC2G53 can handle both analog and digital signals. The device permits signals with amplitudes of up to VCC (peak) to be transmitted in either direction.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet SN74AUC2G53 datasheet (Rev. C) Jan. 05, 2009
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Selection guides Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes How to Select Little Logic (Rev. A) Jul. 26, 2016
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application notes Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guides Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes Designing With TI Ultra-Low-Voltage CMOS (AUC) Octals and Widebus Devices Mar. 21, 2003
User guides AUC Data Book, January 2003 (Rev. A) Jan. 01, 2003
Application notes Texas Instruments Little Logic Application Report Nov. 01, 2002
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
More literature AUC Product Brochure (Rev. A) Mar. 18, 2002

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODELS Download
SCEJ182.ZIP (90 KB) - HSpice Model
SIMULATION MODELS Download
SCEM366A.ZIP (51 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 8 View options
SM8 (DCT) 8 View options
VSSOP (DCU) 8 View options

Ordering & quality

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