SN74AUP1G00

ACTIVE

Low-Power Single Two-Input Positive-NAND Gate

Top

Product details

Parameters

Technology Family AUP VCC (Min) (V) 0.8 VCC (Max) (V) 3.6 Channels (#) 1 Inputs per channel 1 IOL (Max) (mA) 4 IOH (Max) (mA) -4 Input type Standard CMOS Output type Push-Pull Features Partial Power Down (Ioff), Over-Voltage Tolerant Inputs, Very High Speed (tpd 5-10ns) Data rate (Max) (Mbps) 100 Rating Catalog Operating temperature range (C) -40 to 85 open-in-new Find other NAND gate

Package | Pins | Size

DSBGA (YFP) 6 1 mm² .8 x 1.2 DSBGA (YZP) 5 2 mm² .928 x 1.428 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-5X3 (DRL) 5 3 mm² 1.6 x 1.6 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DPW) 5 1 mm² .8 x .8 X2SON (DSF) 6 1 mm² 1 x 1 open-in-new Find other NAND gate

Features

  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Ultra Small 0.64 mm2 Package (DPW) with 0.5-mm Pitch
  • Low Static-Power Consumption (ICC = 0.9 µA Max)
  • Low Dynamic-Power Consumption (Cpd = 4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise Overshoot and Undershoot <10% of VCC
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.8 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
open-in-new Find other NAND gate

Description

This single 2-input positive-NAND gate performs the Boolean function Y = A × B or Y = A + B in positive logic.

open-in-new Find other NAND gate
Download

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 8
Type Title Date
* Datasheet SN74AUP1G00 Low-Power Single 2-Input Positive-NAND Gate datasheet (Rev. J) Dec. 07, 2016
Technical articles How to keep your motor running safely Jun. 04, 2020
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Application note Designing and Manufacturing with TI's X2SON Packages Aug. 23, 2017
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Understanding Schmitt Triggers Sep. 21, 2011
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODEL Download
SCEM461A.ZIP (64 KB) - IBIS Model
SIMULATION MODEL Download
SCEM695.ZIP (7 KB) - PSpice Model

Reference designs

REFERENCE DESIGNS Download
High Speed DLP Sub-system for Industrial 3D Printing and Digital Lithography Reference Design
TIDA-00570 The High Speed DLP® Sub-system Reference Design provides system-level DLP development board designs for industrial Digital Lithography and 3D Printing applications that require high resolution, superior speed and production reliability. The system design offers maximum throughput by integrating (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
DSBGA (YFP) 6 View options
DSBGA (YZP) 5 View options
SC70 (DCK) 5 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 5 View options
SOT-5X3 (DRL) 5 View options
X2SON (DPW) 5 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos

Related videos