Product details

Technology Family AUP Supply voltage (Min) (V) 0.8 Supply voltage (Max) (V) 3.6 Number of channels (#) 1 Inputs per channel 1 IOL (Max) (mA) 4 IOH (Max) (mA) -4 Input type Standard CMOS Output type Push-Pull Features Partial power down (Ioff), Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Data rate (Max) (Mbps) 100 Rating Catalog
Technology Family AUP Supply voltage (Min) (V) 0.8 Supply voltage (Max) (V) 3.6 Number of channels (#) 1 Inputs per channel 1 IOL (Max) (mA) 4 IOH (Max) (mA) -4 Input type Standard CMOS Output type Push-Pull Features Partial power down (Ioff), Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Data rate (Max) (Mbps) 100 Rating Catalog
DSBGA (YFP) 6 1 mm² .8 x 1.2 DSBGA (YZP) 5 2 mm² .928 x 1.428 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-5X3 (DRL) 5 2 mm² 1.65 x 1.2 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DPW) 5 1 mm² .8 x .8 X2SON (DSF) 6 1 mm² 1 x 1
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Ultra Small 0.64 mm2 Package (DPW) with 0.5-mm Pitch
  • Low Static-Power Consumption (ICC = 0.9 µA Max)
  • Low Dynamic-Power Consumption (Cpd = 4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise Overshoot and Undershoot <10% of VCC
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.8 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Ultra Small 0.64 mm2 Package (DPW) with 0.5-mm Pitch
  • Low Static-Power Consumption (ICC = 0.9 µA Max)
  • Low Dynamic-Power Consumption (Cpd = 4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise Overshoot and Undershoot <10% of VCC
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.8 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

This single 2-input positive-NAND gate performs the Boolean function Y = A × B or Y = A + B in positive logic.

This single 2-input positive-NAND gate performs the Boolean function Y = A × B or Y = A + B in positive logic.

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Technical documentation

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Type Title Date
* Data sheet SN74AUP1G00 Low-Power Single 2-Input Positive-NAND Gate datasheet (Rev. J) 07 Dec 2016
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Application note Designing and Manufacturing with TI's X2SON Packages 23 Aug 2017
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding Schmitt Triggers 21 Sep 2011
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic EVM supporting 5 through 8 pin DCK, DCT, DCU, DRL, and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
In stock
Limit: 5
Simulation model

SN74AUP1G00 IBIS Model (Rev. A)

SCEM461A.ZIP (64 KB) - IBIS Model
Simulation model

SN74AUP1G00 Behavioral SPICE Model

SCEM695.ZIP (7 KB) - PSpice Model
Reference designs

TIDA-00570 — High Speed DLP Sub-system for Industrial 3D Printing and Digital Lithography Reference Design

The High Speed DLP® Sub-system Reference Design provides system-level DLP development board designs for industrial Digital Lithography and 3D Printing applications that require high resolution, superior speed and production reliability. The system design offers maximum throughput by integrating (...)
Package Pins Download
DSBGA (YFP) 6 View options
DSBGA (YZP) 5 View options
SC70 (DCK) 5 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 5 View options
SOT-5X3 (DRL) 5 View options
X2SON (DPW) 5 View options

Ordering & quality

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