SN74CB3T3125

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Product details

Protocols Analog Configuration 1:1 SPST Number of channels 4 Bandwidth (MHz) 100 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Operating temperature range (°C) -40 to 85 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 4.5 CON (typ) (pF) 4 OFF-state leakage current (max) (µA) 10 Ron (max) (mΩ) 8000 VIH (min) (V) 1.7 VIL (max) (V) 0.8 Rating Catalog
Protocols Analog Configuration 1:1 SPST Number of channels 4 Bandwidth (MHz) 100 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Operating temperature range (°C) -40 to 85 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 4.5 CON (typ) (pF) 4 OFF-state leakage current (max) (µA) 10 Ron (max) (mΩ) 8000 VIH (min) (V) 1.7 VIL (max) (V) 0.8 Rating Catalog
VQFN (RGY) 14 12.25 mm² (3.5 mm × 3.5 mm) TSSOP (PW) 14 32 mm² (5 mm × 6.4 mm) TVSOP (DGV) 14 23.04 mm² (3.6 mm × 6.4 mm)
  • Output Voltage Translation Tracks VCC
  • Supports Mixed-Mode Signal Operation On All Data I/O Ports
    • 5-V Input Down to 3.3-V Output-Level Shift With 3.3-V VCC
    • 5-V/3.3-V Input Down to 2.5-V Output-Level Shift With 2.5-V VCC
  • 5-V-Tolerant I/Os With Device Powered Up or Powered Down
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron) Characteristics
    (ron = 5 Ω Typical)
  • Low Input/Output Capacitance Minimizes Loading
    (Cio(OFF) = 4.5 pF Typical)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption (ICC = 20 µA Max)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0- to 5-V Signaling Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
  • Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Output Voltage Translation Tracks VCC
  • Supports Mixed-Mode Signal Operation On All Data I/O Ports
    • 5-V Input Down to 3.3-V Output-Level Shift With 3.3-V VCC
    • 5-V/3.3-V Input Down to 2.5-V Output-Level Shift With 2.5-V VCC
  • 5-V-Tolerant I/Os With Device Powered Up or Powered Down
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron) Characteristics
    (ron = 5 Ω Typical)
  • Low Input/Output Capacitance Minimizes Loading
    (Cio(OFF) = 4.5 pF Typical)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption (ICC = 20 µA Max)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0- to 5-V Signaling Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
  • Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

The SN74CB3T3125 is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks VCC. The SN74CB3T3125 supports systems using 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS switching standards, as well as user-defined switching levels (see Typical DC Voltage-Translation Characteristics).

The SN74CB3T3125 is organized as four 1-bit bus switches with separate output-enable (1OE, 2OE, 3OE, 4OE) inputs. It can be used as four 1-bit bus switches or as one 4-bit bus switch. When OE is low, the associated 1-bit bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the associated 1-bit bus switch is OFF, and the high-impedance state exists between the A and B ports.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74CB3T3125 is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks VCC. The SN74CB3T3125 supports systems using 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS switching standards, as well as user-defined switching levels (see Typical DC Voltage-Translation Characteristics).

The SN74CB3T3125 is organized as four 1-bit bus switches with separate output-enable (1OE, 2OE, 3OE, 4OE) inputs. It can be used as four 1-bit bus switches or as one 4-bit bus switch. When OE is low, the associated 1-bit bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the associated 1-bit bus switch is OFF, and the high-impedance state exists between the A and B ports.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet SN74CB3T3125 Quadruple FET Bus Switch 2.5-V, 3.3-V Low-Voltage Bus Switch with 5-V-Tolerant Level Shifter datasheet (Rev. C) PDF | HTML Dec 20, 2018
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML Jun 2, 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML Dec 1, 2021
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML Jan 6, 2021

Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

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SN74CB3T3125 IBIS Model

SCDM024.ZIP (26 KB) - IBIS model
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Package Pins CAD symbols, footprints & 3D models
VQFN (RGY) 14 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian
TVSOP (DGV) 14 Ultra Librarian

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