SN74CBTLV3861

ACTIVE

Product details

Protocols Analog Configuration 1:1 SPST Number of channels 10 Bandwidth (MHz) 200 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 5 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 40000 VIH (min) (V) 1.7 VIL (max) (V) 0.8 Rating Catalog
Protocols Analog Configuration 1:1 SPST Number of channels 10 Bandwidth (MHz) 200 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 5 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 40000 VIH (min) (V) 1.7 VIL (max) (V) 0.8 Rating Catalog
TVSOP (DGV) 24 32 mm² (5 mm × 6.4 mm) SOIC (DW) 24 159.65 mm² (15.5 mm × 10.3 mm) SOP (NS) 24 117 mm² (15 mm × 7.8 mm) TSSOP (PW) 24 49.92 mm² (7.8 mm × 6.4 mm) SSOP (DBQ) 24 51.9 mm² (8.65 mm × 6 mm)
  • 5- Switch Connection Between Two Ports
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

  • 5- Switch Connection Between Two Ports
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

The SN74CBTLV3861 provides ten bits of high-speed bus switching. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.

The device is organized as one 10-bit bus switch. When output enable (OE\) is low, the 10-bit bus switch is on, and port A is connected to port B. When OE\ is high, the switch is open, and the high-impedance state exists between the two ports.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74CBTLV3861 provides ten bits of high-speed bus switching. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.

The device is organized as one 10-bit bus switch. When output enable (OE\) is low, the 10-bit bus switch is on, and port A is connected to port B. When OE\ is high, the switch is open, and the high-impedance state exists between the two ports.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet SN74CBTLV3861 datasheet (Rev. H) Oct 10, 2003
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML Jun 2, 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML Dec 1, 2021
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML Jan 6, 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
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Simulation model

HSPICE Model for SN74CBTLV3861

SCDM127.ZIP (102 KB) - HSpice model
Supported products & hardware
Simulation model

SN74CBTLV3861 IBIS Model

SCDM126.ZIP (26 KB) - IBIS model
Supported products & hardware
Package Pins CAD symbols, footprints & 3D models
TVSOP (DGV) 24 Ultra Librarian
SOIC (DW) 24 Ultra Librarian
SOP (NS) 24 Ultra Librarian
TSSOP (PW) 24 Ultra Librarian
SSOP (DBQ) 24 Ultra Librarian

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