5-V, 4:1, 2-channel analog multiplexer
Product details
Parameters
Package | Pins | Size
Features
- 2-V to 5.5-V VCC Operation
- Fast Switching
- High On-Off Output-Voltage Ratio
- Low Crosstalk Between Switches
- Extremely Low Input Current
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22:
- 2000-V Human-Body Model (A114-A)
- 1000-V Charged-Device Model (C101)
Description
The SN74LV4052A device is a dual, 4-channel CMOS analog multiplexer and demultiplexer that is designed for 2-V to 5.5-V VCC operation.
The SN74LV4052A device handles both analog and digital signals. Each channel permits signals with amplitudes up to 5.5 V (peak) to be transmitted in either direction.
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Technical documentation
= Top documentation for this product selected by TI
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | SN74LV4052A Dual 4-Channel Analog Multiplexers and Demultiplexers datasheet (Rev. K) | Nov. 18, 2016 |
| Application notes | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
| Application notes | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
| Technical articles | Roll with the design punches and overcome power-sequencing challenges | Jul. 29, 2019 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
LEADED-ADAPTER1
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
LEADLESS-ADAPTER1
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Reference designs
TIDA-010048 — This reference design is a four channel-to-channel, isolated 4–20 mA, current-loop analog input module. The design includes a short circuit, overcurrent, and overvoltage limit function for condition monitoring sensor and module applications. The major features of this analog input module (...)
Design files
-
download TIDA-010048 BOM.pdf (104KB) -
download TIDA-010048 Assembly Drawing.pdf (1348KB) -
download TIDA-010048 PCB.pdf (1366KB) -
download TIDA-010048 CAD Files.zip (3092KB) -
download TIDA-010048 Gerber.zip (1559KB)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| PDIP (N) | 16 | View options |
| SO (NS) | 16 | View options |
| SOIC (D) | 16 | View options |
| SSOP (DB) | 16 | View options |
| TSSOP (PW) | 16 | View options |
| TVSOP (DGV) | 16 | View options |
| VQFN (RGY) | 16 | View options |
Ordering & quality
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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