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Product details

Parameters

Configuration 4:1 Number of channels (#) 2 Ron (Typ) (Ohms) 25 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 50 Operating temperature range (C) -40 to 85 Input/output continuous current (Max) (mA) 25 Rating Catalog CON (Typ) (pF) 5.6 open-in-new Find other Analog switches/muxes

Package | Pins | Size

PDIP (N) 16 181 mm² 19.3 x 9.4 SOIC (D) 16 59 mm² 9.9 x 6 SOP (NS) 16 80 mm² 10.2 x 7.8 SSOP (DB) 16 48 mm² 6.2 x 7.8 TSSOP (PW) 16 22 mm² 4.4 x 5 TSSOP (PW) 16 22 mm² 5 x 4.4 TVSOP (DGV) 16 23 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5 open-in-new Find other Analog switches/muxes

Features

  • 2-V to 5.5-V VCC Operation
  • Fast Switching
  • High On-Off Output-Voltage Ratio
  • Low Crosstalk Between Switches
  • Extremely Low Input Current
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22:
    • 2000-V Human-Body Model (A114-A)
    • 1000-V Charged-Device Model (C101)
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Description

The SN74LV4052A device is a dual, 4-channel CMOS analog multiplexer and demultiplexer that is designed for 2-V to 5.5-V VCC operation.

The SN74LV4052A device handles both analog and digital signals. Each channel permits signals with amplitudes up to 5.5 V (peak) to be transmitted in either direction.

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Technical documentation

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Type Title Date
* Datasheet SN74LV4052A Dual 4-Channel Analog Multiplexers and Demultiplexers datasheet (Rev. K) Nov. 18, 2016
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Technical articles Is charge injection causing output voltage errors in your industrial control system? Oct. 18, 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
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Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Reference designs

REFERENCE DESIGNS Download
Channel-to-channel isolated analog input module reference design
TIDA-010048 — This reference design is a four channel-to-channel, isolated 4–20 mA, current-loop analog input module. The design includes a short circuit, overcurrent, and overvoltage limit function for condition monitoring sensor and module applications. The major features of this analog input module (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
PDIP (N) 16 View options
SO (NS) 16 View options
SOIC (D) 16 View options
SSOP (DB) 16 View options
TSSOP (PW) 16 View options
TVSOP (DGV) 16 View options
VQFN (RGY) 16 View options

Ordering & quality

Support & training

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