Product details
Parameters
Package | Pins | Size
Features
- Available in the Texas Instruments NanoFree Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Supports Down Translation to VCC
- Max tpd of 4.5 ns at 3.3 V
- Low Power Consumption, 10-µA Max ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
- Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II - ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
Description
The SN74LVC1G27 device performs the Boolean function Y = A + B + C or Y = A • B • C in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
Technical documentation
= Top documentation for this product selected by TI
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Design tools & simulation
SCEM370A.ZIP (44 KB) - IBIS Model
SCEM634.ZIP (8 KB) - PSpice Model
Reference designs
TIDA-01070 — This design provides a reference for monitoring airflow efficiency and temperature through heat ventilation and air conditioner (HVAC) systems. The reference design is used in conjunction with solid state relays and piezoelectric vibration sensors to monitor and react accordingly to low airflow and (...)
Design files
-
download TIDA-01070 BOM.pdf (67KB) -
download TIDA-01070 Assembly Drawing.pdf (428KB) -
download TIDA-01070 PCB.pdf (2425KB) -
download TIDA-01070 CAD Files.zip (2121KB) -
download TIDA-01070 Gerber.zip (628KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
DSBGA (YZP) | 6 | View options |
SC70 (DCK) | 6 | View options |
SON (DRY) | 6 | View options |
SON (DSF) | 6 | View options |
SOT-23 (DBV) | 6 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
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