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Product details

Parameters

Technology Family LVC VCC (Min) (V) 1.65 VCC (Max) (V) 5.5 Channels (#) 2 IOL (Max) (mA) 32 ICC (Max) (uA) 10 IOH (Max) (mA) -32 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs Data rate (Mbps) 300 Rating Catalog open-in-new Find other Non-Inverting buffer/driver

Package | Pins | Size

DSBGA (YZP) 6 2 mm² .927 x 1.427 SOT-23 (DBV) 6 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 6 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DSF) 6 1 mm² 1 x 1 open-in-new Find other Non-Inverting buffer/driver

Features

  • Schmitt-Trigger inputs provide hysteresis
  • Available in the Texas Instruments NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 5.4 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode
    Operation and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per JESD 78,
    Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
open-in-new Find other Non-Inverting buffer/driver

Description

This dual Schmitt-Trigger buffer is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC2G17 device contains two buffers and performs the Boolean function Y = A. The device functions as two independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet SN74LVC2G17 Dual Schmitt-Trigger Buffer datasheet (Rev. N) Jan. 25, 2015
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Application note Understanding Schmitt Triggers Sep. 21, 2011
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits Nov. 06, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) Dec. 18, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
More literature Military Low Voltage Solutions Apr. 04, 2001
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note LVC Characterization Information Dec. 01, 1996
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
User guide Low-Voltage Logic (LVC) Designer's Guide Sep. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODEL Download
SCEM253D.ZIP (43 KB) - IBIS Model
SIMULATION MODEL Download
SCEM615.ZIP (7 KB) - PSpice Model

Reference designs

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TIDA-01455 — The TIDA-01455 is a reinforced isolated, in-line, shunt-based, precision-phase current sensing reference design for three-phase inverters. One of the challenges with GaN or SiC inverters at high PWM switching is accurate phase current sensing across the shunt in presence of noise due to the high PWM (...)
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REFERENCE DESIGNS Download
Multi-MHz GaN Power Stage Reference Design for High-Speed DC/DC Converters
TIDA-01634 — This reference design implements a multi-MHz power stage design based on the LMG1210 half-bridge GaN driver and GaN power High Electron Mobility Transistors (HEMTs). With highly efficient switches and flexible dead-time adjustment, this design can significantly improve power density while achieving (...)
document-generic Schematic
REFERENCE DESIGNS Download
Ultrasonic Distance Measurement using the TLV320AIC3268 miniDSP CODEC Reference Design
TIDA-00403 The TIDA-00403 reference design uses off-the-shelf EVMs for ultrasonic distance measurement solutions using algorithms within the TLV320AIC3268 miniDSP. In conjunction with TI’s PurePath Studio design suite, a robust and user configurable ultrasonic distance measurement system can be designed (...)
document-generic Schematic
REFERENCE DESIGNS Download
Three-Phase BLDC / PMSM Motor Drive with High-Performance Microcontrollers Reference Design
TIDM-RM46XDRV8301KIT This TI design describes a motor control evaluation kit for spinning 3-phase brushless DC and brushless AC (BLAC) - often referred to as permanent magnet synchronous (PMSM) – motors with example of sensorless Field Oriented / Vector Control (FOC). The implementation leverages the DRV8301 (...)
document-generic Schematic
REFERENCE DESIGNS Download
C2000™ Solar DC/DC Converter with Maximum Power Point Tracking (MPPT)
TIDM-SOLAR-DCDC This design is a digitally-controlled, solar DC/DC converter with maximum power point tracking (MPPT), for use in central or string solar inverters. It is a companion to the TI Design TIDM-SOLAR-ONEPHINV, a grid-tied, single phase, DC/AC inverter. Together, the TIDM-SOLAR-DCDC and the (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 6 View options
SC70 (DCK) 6 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 6 View options

Ordering & quality

Information included:
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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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