5-V, 1:1 (SPST), 2-channel general-purpose analog switch with low on-state resistance
Product details
Parameters
Package | Pins | Size
Features
- Available in the Texas Instruments
NanoFree™ Package - 1.65-V to 5.5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 0.8 ns at 3.3 V
- High On-Off Output Voltage Ratio
- High Degree of Linearity
- High Speed, Typically 0.5 ns
(VCC = 3 V, CL = 50 pF) - Rail-to-Rail Input/Output
- Low ON-State Resistance, Typically ≉6 Ω
(VCC = 4.5 V) - Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
All trademarks are the property of their respective owners.
Description
This dual bilateral analog switch is designed for
1.65-V to 5.5-V VCC operation.
The SN74LVC2G66 device can handle both analog and digital signals. The SN74LVC2G66 device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the associated switch section.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Design tools & simulation
Reference designs
Design files
-
download TIDA-01572 BOM.pdf (74KB) -
download TIDA-01572 Assembly Drawing.pdf (469KB) -
download TIDA-01572 PCB.pdf (2766KB) -
download TIDA-01572 CAD Files.zip (2934KB) -
download TIDA-01572 Gerber.zip (1650KB)
Design files
-
download EtherCAT Slave and Multi-Protocol Industrial Ethernet Assembly Drawing (Rev. A).pdf (894KB) -
download EtherCAT Slave and Multi-Protocol Industrial Ethernet BOM (Rev. A).pdf (79KB) -
download EtherCAT Slave and Multi-Protocol Industrial Ethernet CAD Files (Rev. A).zip (3037KB) -
download EtherCAT Slave and Multi-Protocol Industrial Ethernet Gerber (Rev. A).zip (6730KB) -
download EtherCAT Slave and Multi-Protocol Industrial Ethernet PCB (Rev. A).pdf (6631KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
DSBGA (YZP) | 8 | View options |
SM8 (DCT) | 8 | View options |
VSSOP (DCU) | 8 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.