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SN74LVC2G66

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5-V, 1:1 (SPST), 2-channel general-purpose analog switch with low on-state resistance

Data sheet
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5-V, 1:1 (SPST), 2-channel general-purpose analog switch with low on-state resistance

SN74LVC2G66

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Data sheet Order now

Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 6 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 300 Operating temperature range (C) -40 to 85 Features Supports I2C signals Input/output continuous current (Max) (mA) 50 Rating Catalog CON (Typ) (pF) 14 Supply current (Typ) (uA) 1 open-in-new Find other Analog switches & muxes

Package | Pins | Size

DSBGA (YZP) 8 3 mm² .928 x 1.928 SSOP (DCT) 8 8 mm² 3 x 2.8 SSOP (DCT) 8 8 mm² 2.95 x 2.80 VSSOP (DCU) 8 6 mm² 2 x 3.1 open-in-new Find other Analog switches & muxes

Features

  • Available in the Texas Instruments
    NanoFree™ Package
  • 1.65-V to 5.5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 0.8 ns at 3.3 V
  • High On-Off Output Voltage Ratio
  • High Degree of Linearity
  • High Speed, Typically 0.5 ns
    (VCC = 3 V, CL = 50 pF)
  • Rail-to-Rail Input/Output
  • Low ON-State Resistance, Typically ≉6 Ω
    (VCC = 4.5 V)
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
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Description

This dual bilateral analog switch is designed for
1.65-V to 5.5-V VCC operation.

The SN74LVC2G66 device can handle both analog and digital signals. The SN74LVC2G66 device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the associated switch section.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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Technical documentation

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Type Title Date
* Data sheet SN74LVC2G66 Dual Bilateral Analog Switch datasheet (Rev. N) Aug. 20, 2018
Application note Selecting the Right Texas Instruments Signal Switch (Rev. C) Aug. 06, 2021
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) Jul. 26, 2021
Application note Multiplexers and Signal Switches Glossary (Rev. A) Jun. 09, 2021
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits Nov. 06, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
More literature I2C and Serial Bus Devices Application Clip Jul. 10, 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) Dec. 18, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note LVC Characterization Information Dec. 01, 1996
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide Sep. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
10
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
View details
INTERFACE ADAPTER Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


View details
INTERFACE ADAPTER Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel
View details

Design tools & simulation

SIMULATION MODEL Download
SCEJ257.ZIP (87 KB) - HSpice Model
SIMULATION MODEL Download
SCEM446.ZIP (34 KB) - IBIS Model

Reference designs

REFERENCE DESIGNS Download
EtherCAT Slave and Multi-Protocol Industrial Ethernet Reference Design
TIDA-00299 — This reference design implements a cost-optimized high EMC immunity EtherCAT slave (dual ports) with SPI-interface to the application processor. The hardware design is capable of supporting multi-protocol industrial ethernet and field-busses using the AMIC110 industrial communications processor. The (...)
document-generic Schematic
REFERENCE DESIGNS Download
Stereo Evaluation Module Reference Design of the Digital Input, Class-D, IV Sense Audio Amplifier
TIDA-01572 — This reference design provides a high-performance stereo audio subsystem for use in PC applications. It operates off a single supply, ranging from 4.5 V to 16 V, and features the TAS2770, a digital-input Class-D audio amplifier that provides excellent noise and distortion performance and is (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 8 View options
SM8 (DCT) 8 View options
VSSOP (DCU) 8 View options

Ordering & quality

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  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

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