Qualified for Automotive Applications
AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to 125°C Ambient
  Operating Temperature Range
- Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C3B
1.65-V to 5.5-V V_CC Operation
Inputs Accept Voltages to 5.5 V
High On-Off Output Voltage Ratio
High Degree of Linearity
High Speed, Typically 0.5 ns
(V_CC= 3 V, C_L = 50 pF)
Rail-to-Rail Input/Output
Low On-State Resistance, Typically ≠6 Ω
(V_CC = 4.5 V)

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The design of this dual bilateral analog switch is for 1.65-V to 5.5-V V_CC operation. The SN74LVC2G66-Q1 can handle both analog and digital signals. The device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction. Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the associated switch section.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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Technical documentation

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	Type	Title	Date
*	Datasheet	Dual Bilateral Analog Switch . datasheet (Rev. A)	Jul. 27, 2012
	Application note	Selecting the Right Texas Instruments Signal Switch (Rev. B)	Apr. 02, 2020
	Application note	Multiplexers and Signal Switches Glossary	Mar. 06, 2020
	Selection guide	Little Logic Guide 2018 (Rev. G)	Jul. 06, 2018
	Selection guide	Logic Guide (Rev. AB)	Jun. 12, 2017
	Application note	How to Select Little Logic (Rev. A)	Jul. 26, 2016
	Application note	Implications of Slow or Floating CMOS Inputs (Rev. D)	Jun. 23, 2016
	Application note	Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)	Dec. 02, 2015
	More literature	Automotive Logic Devices Brochure	Aug. 27, 2014
	User guide	LOGIC Pocket Data Book (Rev. B)	Jan. 16, 2007
	More literature	Design Summary for WCSP Little Logic (Rev. B)	Nov. 04, 2004
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection	Jul. 08, 2004
	Application note	Selecting the Right Level Translation Solution (Rev. A)	Jun. 22, 2004
	User guide	Signal Switch Data Book (Rev. A)	Nov. 14, 2003
	Application note	Use of the CMOS Unbuffered Inverter in Oscillator Circuits	Nov. 06, 2003
	More literature	Logic Cross-Reference (Rev. A)	Oct. 07, 2003
	User guide	LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B)	Dec. 18, 2002
	Application note	Texas Instruments Little Logic Application Report	Nov. 01, 2002
	Application note	TI IBIS File Creation, Validation, and Distribution Processes	Aug. 29, 2002
	More literature	Standard Linear & Logic for PCs, Servers & Motherboards	Jun. 13, 2002
	Application note	16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)	May 22, 2002
	Application note	Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices	May 10, 2002
	More literature	STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS	Mar. 27, 2002
	More literature	Military Low Voltage Solutions	Apr. 04, 2001
	Application note	Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices	Dec. 01, 1997
	Application note	Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)	Aug. 01, 1997
	Application note	CMOS Power Consumption and CPD Calculation (Rev. B)	Jun. 01, 1997
	Application note	LVC Characterization Information	Dec. 01, 1996
	Application note	Input and Output Characteristics of Digital Integrated Circuits	Oct. 01, 1996
	Application note	Live Insertion	Oct. 01, 1996
	User guide	Low-Voltage Logic (LVC) Designer's Guide	Sep. 01, 1996
	Application note	Understanding Advanced Bus-Interface Products Design Guide	May 01, 1996

Design & development

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Hardware development

EVALUATION BOARD Download

DIP Adapter Evaluation Module

DIP-ADAPTER-EVM

Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features

Simplifies prototyping of SMT IC’s
Supports 6 common package types
Low Cost

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INTERFACE ADAPTER Download

Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

LEADED-ADAPTER1

Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.

Features

Quick testing of TI's leaded surface mount packages
Allows leaded suface mount packages to be plugged into 100mil spaced bread board
Supports TI's 8 most popular leaded packages with a single panel

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