Automotive 5-V, 1:1 (SPST), 2-channel analog switch
Product details
Parameters
Package | Pins | Size
Features
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to 125°C Ambient
Operating Temperature Range - Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C3B
- Device Temperature Grade 1: –40°C to 125°C Ambient
- 1.65-V to 5.5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- High On-Off Output Voltage Ratio
- High Degree of Linearity
- High Speed, Typically 0.5 ns
(VCC = 3 V, CL = 50 pF) - Rail-to-Rail Input/Output
- Low On-State Resistance, Typically ≠6 Ω
(VCC = 4.5 V)
Description
The design of this dual bilateral analog switch is for 1.65-V to 5.5-V VCC operation. The SN74LVC2G66-Q1 can handle both analog and digital signals. The device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction. Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the associated switch section.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| VSSOP (DCU) | 8 | View options |
Ordering & quality
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