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SOIC (D) 8 19 mm² 4.9 x 3.9 VSON (DRB) 8 9 mm² 3 x 3
  • AEC-Q100 Qualified for automotive applications
    • Temperature grade 1: –40°C to 125°C TA
    • Device HBM certification level: ±8 kV
    • Device CDM certification level: ±1.5 kV
  • Compliant to LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2 A and ISO/DIS 17987–4.2 (See SLLA490)
  • Conforms to SAE J2602 recommended practice for LIN (See SLLA490)
  • Supports 12 V applications
  • LIN transmit data rate up to 20-kbps
  • Wide operating ranges
    • 4-V to 36-V Supply voltage
    • ±45-V LIN bus fault protection
  • Sleep mode: ultra-low current consumption allows wake-up event from:
    • LIN bus
    • Local wake up through EN
  • Power up and down glitch free operation
  • Protection features:
    • Under voltage protection on VSUP
    • TXD Dominant time out protection (DTO)
    • Thermal shutdown protection
    • Unpowered node or ground disconnection failsafe at system level.
  • Available in SOIC (8) and leadless VSON (8) packages with improved automated optical inspection (AOI) capability
  • AEC-Q100 Qualified for automotive applications
    • Temperature grade 1: –40°C to 125°C TA
    • Device HBM certification level: ±8 kV
    • Device CDM certification level: ±1.5 kV
  • Compliant to LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2 A and ISO/DIS 17987–4.2 (See SLLA490)
  • Conforms to SAE J2602 recommended practice for LIN (See SLLA490)
  • Supports 12 V applications
  • LIN transmit data rate up to 20-kbps
  • Wide operating ranges
    • 4-V to 36-V Supply voltage
    • ±45-V LIN bus fault protection
  • Sleep mode: ultra-low current consumption allows wake-up event from:
    • LIN bus
    • Local wake up through EN
  • Power up and down glitch free operation
  • Protection features:
    • Under voltage protection on VSUP
    • TXD Dominant time out protection (DTO)
    • Thermal shutdown protection
    • Unpowered node or ground disconnection failsafe at system level.
  • Available in SOIC (8) and leadless VSON (8) packages with improved automated optical inspection (AOI) capability

The TLIN1029-Q1 is a local interconnect network (LIN) physical layer transceiver with integrated wake-up and protection features, compliant to LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2 A and ISO/DIS 17987–4.2 standards. LIN is a single-wire bidirectional bus typically used for low speed in-vehicle networks using data rates up to 20 kbps. The TLIN1029-Q1 is designed to support 12-V applications with wider operating voltage and additional bus-fault protection. The LIN receiver supports data rates up to 100 kbps for faster in-line programming. The TLIN1029-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus signal using a current-limited wave-shaping driver which reduces electromagnetic emissions (EME). The receiver converts the data stream to logic level signals that are sent to the microprocessor through the open-drain RXD pin. Ultra-low current consumption is possible using the sleep mode which allows wake-up via LIN bus or pin.

The integrated resistor, electrostatic discharge (ESD) and fault protection allows designers to save board space in their applications.

The TLIN1029-Q1 is a local interconnect network (LIN) physical layer transceiver with integrated wake-up and protection features, compliant to LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2 A and ISO/DIS 17987–4.2 standards. LIN is a single-wire bidirectional bus typically used for low speed in-vehicle networks using data rates up to 20 kbps. The TLIN1029-Q1 is designed to support 12-V applications with wider operating voltage and additional bus-fault protection. The LIN receiver supports data rates up to 100 kbps for faster in-line programming. The TLIN1029-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus signal using a current-limited wave-shaping driver which reduces electromagnetic emissions (EME). The receiver converts the data stream to logic level signals that are sent to the microprocessor through the open-drain RXD pin. Ultra-low current consumption is possible using the sleep mode which allows wake-up via LIN bus or pin.

The integrated resistor, electrostatic discharge (ESD) and fault protection allows designers to save board space in their applications.

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Technical documentation

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Type Title Date
* Data sheet TLIN1029-Q1 Local Interconnect Network (LIN) Transceiver with Dominant State Timeout datasheet (Rev. E) 16 May 2020
* Errata TLIN1029-Q1 and TLIN2029-Q1 Duty Cycle Over VSUP 22 May 2020
Technical article How semiconductor technologies are changing automotive lighting roadmaps 24 Oct 2019
Technical article Adding CAN nodes in Bluetooth® Low Energy PEPS systems 11 Jun 2019
User guide SPI to CAN FD SBC + LIN Transceiver BoosterPack User's Guide 01 Apr 2019
Application note CAN and LIN transceiver low-power modes 25 Feb 2019
Application note LIN Protocol and Physical Layer Requirements 28 Feb 2018
Technical article Local Interconnect Network – the last mile network 18 Jan 2018
User guide TLIN2029-Q1 EVM User's Guide 18 Sep 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TLIN2029EVM — Fault-protected local interconnect network (LIN) transceiver with dominant state timeout EVM

This EVM helps designers evaluate device performance, support fast development and analyze automotive local interconnect network (LIN) systems using TLIN2029 LIN physical layer transceiver devices.
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Simulation model

TLIN1029 IBIS Model

SLLM399.ZIP (31 KB) - IBIS Model
Simulation tool

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Simulation tool

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TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
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SOIC (D) 8 View options
SON (DRB) 8 View options

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