The TLV9051, TLV9052, and TLV9054 devices are single, dual, and quad operational amplifiers, respectively. The devices are optimized for low voltage operation from 1.8 V to 5.5 V. The inputs and outputs can operate from rail to rail at a very high slew rate. These devices are perfect for cost-constrained applications where low-voltage operation, high slew rate, and low quiescent current is needed. The capacitive-load drive of the TLV905x family is 150 pF, and the resistive open-loop output impedance makes stabilization easier with much higher capacitive loads.
The TLV905xS devices include a shutdown mode that allow the amplifiers to be switched off into a standby mode with typical current consumption less than 1 µA.
The TLV905x family is easy to use due to the devices being unity-gain stable, including a RFI and EMI filter, and being free from phase reversal in an overdrive condition.
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| Part number | Order | Number of channels (#) | Total supply voltage (Min) (+5V=5, +/-5V=10) | Total supply voltage (Max) (+5V=5, +/-5V=10) | GBW (Typ) (MHz) | Slew rate (Typ) (V/us) | Rail-to-rail | Vos (offset voltage @ 25 C) (Max) (mV) | Iq per channel (Typ) (mA) | Vn at 1 kHz (Typ) (nV/rtHz) | Rating | Operating temperature range (C) | Package Group | Package size: mm2:W x L (PKG) | Offset drift (Typ) (uV/C) | Features | CMRR (Typ) (dB) | Output current (Typ) (mA) | Architecture |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TLV9052 |
|
2 | 1.8 | 5.5 | 5 | 15 |
In
Out |
1.6 | 0.33 | 20 | Catalog | -40 to 125 |
SOIC | 8
SOT-23-THIN | 8 TSSOP | 8 VSSOP | 10 VSSOP | 8 WSON | 8 X2QFN | 10 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8SOT-23-THIN: 8 mm2: 2.8 x 2.9 (SOT-23-THIN | 8) 8TSSOP: 19 mm2: 6.4 x 3 (TSSOP | 8) 10VSSOP: 9 mm2: 3 x 3 (VSSOP | 10) 8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) 8WSON: 4 mm2: 2 x 2 (WSON | 8) 10X2QFN: 3 mm2: 2 x 1.5 (X2QFN | 10) |
0.5 |
Cost Optimized
EMI Hardened Shutdown Small Size |
96 | 50 | CMOS |
| TLV2314 |
|
2 | 1.8 | 5.5 | 3 | 1.5 |
In
Out |
3 | 0.15 | 16 | Catalog | -40 to 125 |
SOIC | 8
VSSOP | 8 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) |
2 |
Cost Optimized
EMI Hardened |
96 | 20 | CMOS |
| TLV2316 |
|
2 | 1.8 | 5.5 | 10 | 6 |
In
Out |
3 | 0.4 | 12 | Catalog | -40 to 125 |
SOIC | 8
VSSOP | 8 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) |
2 |
Cost Optimized
EMI Hardened |
90 | 50 | CMOS |
| TLV9002 |
|
2 | 1.8 | 5.5 | 1 | 2 |
In
Out |
1.5 | 0.06 | 28 | Catalog | -40 to 125 |
SOIC | 8
SOT-23-THIN | 8 TSSOP | 8 VSSOP | 10 VSSOP | 8 WSON | 8 X2QFN | 10 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8SOT-23-THIN: 8 mm2: 2.8 x 2.9 (SOT-23-THIN | 8) 8TSSOP: 19 mm2: 6.4 x 3 (TSSOP | 8) 10VSSOP: 9 mm2: 3 x 3 (VSSOP | 10) 8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) 8WSON: 4 mm2: 2 x 2 (WSON | 8) 10X2QFN: 3 mm2: 2 x 1.5 (X2QFN | 10) |
0.6 |
Cost Optimized
EMI Hardened Shutdown Small Size |
90 | 40 | CMOS |
| TLV9062 |
|
2 | 1.8 | 5.5 |
