TMUX1101

ACTIVE

3-pA, 5-V, 1:1 (SPST), 1-channel precision switch (active high)

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Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 1 Power supply voltage - single (V) 1.2, 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 2 ON-state leakage current (Max) (µA) 0.002 Bandwidth (MHz) 300 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (Max) (mA) 30 Rating Catalog CON (Typ) (pF) 18 Supply current (Typ) (uA) 0.003 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1 open-in-new Find other Analog switches & muxes

Features

  • Wide supply range: 1.08 V to 5.5 V
  • Low leakage current: 3 pA
  • Low charge injection: –1.5 pC
  • Low on-resistance: 1.8 Ω
  • –40°C to +125°C operating temperature
  • 1.8 V Logic compatible
  • Fail-safe logic
  • Rail to rail operation
  • Bidirectional signal path
  • Break-before-make switching
  • ESD protection HBM: 2000 V

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Description

The TMUX1101 and TMUX1102 are precision complementary metal-oxide semiconductor (CMOS) single-pole, single-throw (SPST) switches. Wide operating supply of 1.08 V to 5.5 V allows for use in a broad array of applications from medical equipment to industrial systems. The devices support bidirectional analog and digital signals on the source (S) and drain (D) pins ranging from GND to VDD.

The logic control input (SEL) has 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating within the valid supply voltage range. The switch of the TMUX1101 is turned on when SEL is Logic 1, while TMUX1102 is turned on when SEL is Logic 0. Fail-Safe Logic circuitry allows voltages on the SEL pin to be applied before the supply pin, protecting the device from potential damage.

The TMUX110x devices are part of the precision switches and multiplexers family. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of
3 nA and small package options enable use in portable applications.

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Technical documentation

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No results found. Please clear your search and try again. View all 4
Type Title Date
* Datasheet TMUX110x 5-V, Low-Leakage-Current, 1:1 (SPST) Precision Switch datasheet (Rev. C) Nov. 07, 2019
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
10
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODELS Download
SCDM230.ZIP (8 KB) - IBIS Model
SIMULATION MODELS Download
SCDM242.ZIP (15 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
SC70 (DCK) 5 View options
SOT-23 (DBV) 5 View options

Ordering & quality

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