Low-leakage-current, 2:1 (SPDT), 3-channel precision switches
Product details
Parameters
Package | Pins | Size
Features
- Single supply range: 1.08 V to 5.5 V
- Dual supply range: ±2.75 V
- Low leakage current: 3 pA
- Low charge injection: -1 pC
- Low on-resistance: 2 Ω
- -40°C to +125°C operating temperature
- 1.8 V Logic Compatible
- Fail-Safe Logic
- Rail to Rail Operation
- Bidirectional Signal Path
- Break-before-make switching
- ESD protection HBM: 2000 V
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Description
The TMUX113x devices are precision complementary metal-oxide semiconductor (CMOS) switches with multiple channels. The TMUX1133 is a 2:1, single-pole double-throw (SPDT), configuration with three independently controlled channels and an EN pin to enable or disable all three switches. The TMUX1134 contains four independently controlled SPDT switches. Wide operating supply of 1.08 V to 5.5 V, or ±2.75 V dual supply, allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD. For single supply applications VSS must be connected to GND.
All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX113x devices are part of the precision switches and multiplexers family. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of
8 nA enables use in portable applications.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX113x 5-V, Low-Leakage-Current, 2:1 (SPDT), 3 or 4-Channel Precision Switches datasheet (Rev. A) | Aug. 29, 2019 |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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