3-Ω low ron, 5-V, 2:1 (SPDT) general purpose switch
Product details
Parameters
Package | Pins | Size
Features
- Rail to rail operation
- Bidirectional signal path
- 1.8 V Logic compatible
- Fail-safe logic
- Low on-resistance: 3 Ω
- Wide supply range: 1.08 V to 5.5 V
- -40°C to +125°C Operating temperature
- Low supply current: 4 nA
- Transition time: 14 ns
- Break-before-make switching
- ESD protection HBM: 2000 V
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Description
The TMUX1247 is a general purpose complementary metal-oxide semiconductor (CMOS) single-pole double-throw (SPDT) switch. The TMUX1247 switches between two source inputs based on the state of the SEL pin. Wide operating supply of 1.08 V to 5.5 V allows for use in a broad array of applications from personal electronics to building automation. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD. A low supply current of 4 nA enables use in portable applications.
All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX1247 5-V Bidirectional, 2:1 (SPDT) General Purpose Switch datasheet | Aug. 20, 2018 |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Technical articles | Protecting your power amplifier stage with analog switches | Feb. 18, 2020 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
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Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SC70 (DCK) | 6 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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