5-V, 1:1 (SPST), 4-channel analog switch with powered-off protection & 1.8-V input logic
Product details
Parameters
Package | Pins | Size
Features
- Wide Supply Range: 1.5 V to 5.5 V
- Low On-Capacitance: 3.3 pF
- Low On-Resistance: 2 Ω
- High Bandwidth: 3 GHz
- -40°C to +125°C Operating Temperature
- 1.8 V Logic Compatible
- Supports Input Voltage Beyond Supply
- Integrated Pull Down Resistor on Logic Pins
- Bidirectional Signal Path
- Fail-Safe Logic
- Powered-off Protection up to 3.6 V
- Pinout compatible to SN74CBTLV3126
- Pinout compatible (logic variant) of SN74CBTLV3125
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Description
The TMUX1511 is a complementary metal-oxide semiconductor (CMOS) switch. The TMUX1511 offers 1:1 SPST switch configuration with 4 independently controlled channels. Wide operating supply of 1.5 V to 5.5 V allows for use in a broad array of applications from servers and communication equipment to industrial applications. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins and can pass signals above supply up to VDD x 2, with a maximum input/output voltage of 5.5 V.
Powered-off Protection up to 3.6 V on the signal path of the TMUX1511 provides isolation when the supply voltage is removed (VDD = 0 V). Without this protection feature, switches can back-power the supply rail through an internal ESD diode and cause potential damage to the system.
Fail-Safe Logic circuitry allows voltages on the logic control pins to be applied before the supply pin, protecting the device from potential damage. All logic control inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 14 | View options |
UQFN (RSV) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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