TMUX1511

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5-V, 1:1 (SPST), 4-channel analog switch with powered-off protection & 1.8-V input logic

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Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 2 ON-state leakage current (Max) (µA) 0.05 Bandwidth (MHz) 3000 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Fail-safe logic, Integrated pulldown resistor on logic pin, Powered-off protection, Supports JTAG signals, Supports SPI signals, Supports input voltage beyond supply Input/output continuous current (Max) (mA) 25 Rating Catalog CON (Typ) (pF) 3.3 Supply current (Typ) (uA) 37 open-in-new Find other Analog switches & muxes

Package | Pins | Size

TSSOP (PW) 14 32 mm² 5 x 6.4 UQFN (RSV) 16 5 mm² 2.6 x 1.8 open-in-new Find other Analog switches & muxes

Features

  • Wide Supply Range: 1.5 V to 5.5 V
  • Low On-Capacitance: 3.3 pF
  • Low On-Resistance: 2 Ω
  • High Bandwidth: 3 GHz
  • -40°C to +125°C Operating Temperature
  • 1.8 V Logic Compatible
  • Supports Input Voltage Beyond Supply
  • Integrated Pull Down Resistor on Logic Pins
  • Bidirectional Signal Path
  • Fail-Safe Logic
  • Powered-off Protection up to 3.6 V
    • Pinout compatible to SN74CBTLV3126
    • Pinout compatible (logic variant) of SN74CBTLV3125

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Description

The TMUX1511 is a complementary metal-oxide semiconductor (CMOS) switch. The TMUX1511 offers 1:1 SPST switch configuration with 4 independently controlled channels. Wide operating supply of 1.5 V to 5.5 V allows for use in a broad array of applications from servers and communication equipment to industrial applications. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins and can pass signals above supply up to VDD x 2, with a maximum input/output voltage of 5.5 V.

Powered-off Protection up to 3.6 V on the signal path of the TMUX1511 provides isolation when the supply voltage is removed (VDD = 0 V). Without this protection feature, switches can back-power the supply rail through an internal ESD diode and cause potential damage to the system.

Fail-Safe Logic circuitry allows voltages on the logic control pins to be applied before the supply pin, protecting the device from potential damage. All logic control inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet TMUX1511 Low-Capacitance, 1:1 (SPST) 4-Channel, Powered-Off Protected Switch with 1.8 V Logic datasheet (Rev. A) Dec. 03, 2018
Technical articles Optimizing for protection and precision in servo drive control modules with multiplexers Oct. 09, 2020
Application notes Choosing the Right Multiplexer for a Discrete Programmable Gain Amplifier (PGA) Sep. 29, 2020
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Application notes Enabling SPI-based flash memory expansion by using multiplexers Jan. 17, 2019
Application notes Eliminate power Sequencing with powered-off protection signal switches (Rev. B) Jan. 15, 2019
Application notes Improve Stability Issues with Low Con Multiplexers (Rev. A) Dec. 10, 2018
Application notes 1.8 V Logic for Muxes and Signal May 16, 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODELS Download
SCDM193.ZIP (11 KB) - IBIS Model
SIMULATION MODELS Download
SCDM203.ZIP (7933 KB) - S-Parameter Model
SIMULATION MODELS Download
SCDM236.ZIP (19 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
TSSOP (PW) 14 View options
UQFN (RSV) 16 View options

Ordering & quality

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