Product details

Configuration 8:1 Number of channels (#) 1 Power supply voltage - single (V) 12, 16, 20, 36, 44 Protocols Analog Ron (Typ) (Ohms) 250 CON (Typ) (pF) 40 ON-state leakage current (Max) (µA) 0.025 Bandwidth (MHz) 80 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection, Powered-off protection Input/output continuous current (Max) (mA) 5 Rating Catalog Supply current (Typ) (uA) 250
Configuration 8:1 Number of channels (#) 1 Power supply voltage - single (V) 12, 16, 20, 36, 44 Protocols Analog Ron (Typ) (Ohms) 250 CON (Typ) (pF) 40 ON-state leakage current (Max) (µA) 0.025 Bandwidth (MHz) 80 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection, Powered-off protection Input/output continuous current (Max) (mA) 5 Rating Catalog Supply current (Typ) (uA) 250
TSSOP (PW) 16 22 mm² 5 x 4.4 WQFN (RRP) 16 16 mm² 4 x 4
  • Wide supply range:
    • Dual supply: ±5 V to ±22 V
    • Single supply: 8 V to 44 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Non-fault channels continue to operate
    • Known state without logic inputs present
    • Output clamped to the supply in overvoltage condition
  • Latch-up immune
  • 1.8-V Logic capable
  • Fail-safe logic: up to 44 V independent of supply
  • Integrated pull-down resistor on logic pins
  • Break-before-make switching
  • Industry standard TSSOP and smaller WQFN packages
  • Wide supply range:
    • Dual supply: ±5 V to ±22 V
    • Single supply: 8 V to 44 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Non-fault channels continue to operate
    • Known state without logic inputs present
    • Output clamped to the supply in overvoltage condition
  • Latch-up immune
  • 1.8-V Logic capable
  • Fail-safe logic: up to 44 V independent of supply
  • Integrated pull-down resistor on logic pins
  • Break-before-make switching
  • Industry standard TSSOP and smaller WQFN packages

The TMUX7308F and TMUX7309F are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX7308F and TMUX7309F devices suitable for applications where power supply sequencing cannot be precisely controlled.

The device blocks fault voltage up to +60 V or –60 V relative to ground in both powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of switch input conditions and logic control status. Under normal operation conditions, if the analog input signal level on any Sx pin exceeds the supply voltage (VDD or VSS) by a threshold voltage (VT), the channel turns OFF and the Sx pin becomes high impedance. When the fault channel is selected, the drain pin (D or Dx) is pulled to the supply (VDD or VSS) that was exceeded.

The low capacitance, low charge injection, and integrated fault protection enables the TMUX7308F and TMUX7309F devices to be used in front end data acquisition applications where high performance and high robustness are both critical. The devices are available in a standard TSSOP package and smaller WQFN package (ideal if PCB space is limited).

The TMUX7308F and TMUX7309F are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX7308F and TMUX7309F devices suitable for applications where power supply sequencing cannot be precisely controlled.

The device blocks fault voltage up to +60 V or –60 V relative to ground in both powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of switch input conditions and logic control status. Under normal operation conditions, if the analog input signal level on any Sx pin exceeds the supply voltage (VDD or VSS) by a threshold voltage (VT), the channel turns OFF and the Sx pin becomes high impedance. When the fault channel is selected, the drain pin (D or Dx) is pulled to the supply (VDD or VSS) that was exceeded.

The low capacitance, low charge injection, and integrated fault protection enables the TMUX7308F and TMUX7309F devices to be used in front end data acquisition applications where high performance and high robustness are both critical. The devices are available in a standard TSSOP package and smaller WQFN package (ideal if PCB space is limited).

Download

Technical documentation

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Not available on TI.com
Simulation model

TMUX7308F IBIS Model

SCDM281.ZIP (31 KB) - IBIS Model
Simulation model

TMUX7308F PSPICE Model

SCDM297.ZIP (56 KB) - PSpice Model
Package Pins Download
TSSOP (PW) 16 View options
WQFN (RRP) 16 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos