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TMUX7462F

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±60-V fault-protected, latch-up immune, 4-channel protector, adjustable fault threshold, 1.8-V logic

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Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 12, 16, 20, 36, 44 Ron (Typ) (Ohms) 9.5 ON-state leakage current (Max) (µA) 0.025 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection Input/output continuous current (Max) (mA) 50 Rating Catalog CON (Typ) (pF) 20 Supply current (Typ) (uA) 300 open-in-new Find other Analog switches & muxes

Features

  • Wide Supply Range: ±5 V to ±22 V (Dual), 8 V to 44 V (Single)
  • Channel Protector Without Need for Dedicated Select Pin Per Channel
    • Reduces Number of Control Logic Signals to Route Across PCB
  • Integrated Fault Protection:
    • Overvoltage Protection, Source to Supplies or to Drain: ±85 V
    • Overvoltage Protection: ±60 V
    • Powered-Off Protection: ±60 V
    • Interrupt Flags to Indicate Fault Status
    • Adjustable Overvoltage Triggering Threshold from 3 V to Supplies
    • Adjustable Output Behavior (Clamped or Open) During Fault
  • Latch-Up Immunity by Device Construction
  • Low and Flat On-Resistance (8 Ω Typical)
  • Industry-Standard TSSOP and Smaller WQFN Package
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Description

The TMUX7462F is a four-channel protector that can be placed on the front end of a signal path to protect sensitive components downstream from damages caused by overvoltage faults. Each of the 4 channels has an internal switch that is turned-off autonomously upon occurrence of an overvoltage fault without the need of external controls. This simplifies robust system level protection designs by removing the need for control signals for each channel of the device. The overvoltage protection is available in powered and powered-off conditions, making the TMUX7462F suitable for applications where power supply sequencing cannot be precisely controlled.

The switch channels remain in the high impedance state (regardless of switch input conditions) when the devices power supplies are floating, grounded, or at a level that is below the undervoltage (UV) threshold. If the signal level on any Sx pin exceeds the fault supply (VFP or VFN) by a threshold voltage (VT), then the Sx pin becomes high impedance and an output fault flag is asserted low to indicate a fault condition under normal operation. The drain pin (Dx) is either pulled to the fault supply voltage that was exceeded or left floating depending on the DR control logic.

The device works well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies. The low and flat on-resistance of the device makes the TMUX7462F an ideal solution for data acquisition applications where excellent linearity and low distortion is critical.

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Technical documentation

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* Data sheet TMUX7462F ±60 V Fault-Protected, Latch-Up Immune, Quad Channel Protector with Adjustable Fault Threshold and 1.8-V Logic datasheet Mar. 16, 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
125
Description

The TMUX741-746EVM supports evaluation of the TMUX741xF and TMUX746xF device families in both TSSOP (PW) and WQFN (RRP) packages. This evaluation module (EVM) can be used for quick prototyping and testing of the TMUX741xF and TMUX746xF device families for DC parameter evaluation.

Features
  • Quick prototyping and testing setup for the TMUX741xF and TMUX746xF device families in TSSOP (PW) and WQFN (RRP) packages
  • Supply decoupling capacitors installed for VDD, VSS, VFP, and VFN pins with two extra pads for additional decoupling capacitors if needed
  • Protection diode pads available for all (...)
INTERFACE ADAPTER Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

CAD/CAE symbols

Package Pins Download
(RRP) 16 View options

Ordering & quality

Information included:
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  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

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