Product details

Configuration 4:1 Number of channels 2 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 3.5 CON (typ) (pF) 178 ON-state leakage current (max) (µA) 0.062 Supply current (typ) (µA) 40 Bandwidth (MHz) 31 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 300 Rating Catalog Drain supply voltage (max) (V) 22 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -22
Configuration 4:1 Number of channels 2 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 3.5 CON (typ) (pF) 178 ON-state leakage current (max) (µA) 0.062 Supply current (typ) (µA) 40 Bandwidth (MHz) 31 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 300 Rating Catalog Drain supply voltage (max) (V) 22 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -22
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RUM) 16 16 mm² 4 x 4
  • Latch-up immune
  • Dual supply range: ±4.5 V to ±22 V
  • Single supply range: 4.5 V to 44 V
  • Low on-resistance: 4 Ω
  • Low charge injection: 3 pC
  • High current support: 400 mA (maximum) (WQFN)
  • High current support: 300 mA (maximum) (TSSOP)
  • –40°C to +125°C operating temperature
  • 1.8 V logic compatible inputs
  • Integrated pull-down resistor on logic pins
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional signal path
  • Break-before-make switching
  • Latch-up immune
  • Dual supply range: ±4.5 V to ±22 V
  • Single supply range: 4.5 V to 44 V
  • Low on-resistance: 4 Ω
  • Low charge injection: 3 pC
  • High current support: 400 mA (maximum) (WQFN)
  • High current support: 300 mA (maximum) (TSSOP)
  • –40°C to +125°C operating temperature
  • 1.8 V logic compatible inputs
  • Integrated pull-down resistor on logic pins
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional signal path
  • Break-before-make switching

The TMUX7208 is a precision 8:1, single channel multiplexer while the TMUX7209 is a 4:1, 2 channel multiplexer featuring low on resistance and charge injection. The devices work with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX720x support bidirectional analog and digital signals onthe source (Sx) and drain (D) pins ranging from VSS to VDD.

The TMUX720x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications. The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.

The TMUX7208 is a precision 8:1, single channel multiplexer while the TMUX7209 is a 4:1, 2 channel multiplexer featuring low on resistance and charge injection. The devices work with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX720x support bidirectional analog and digital signals onthe source (Sx) and drain (D) pins ranging from VSS to VDD.

The TMUX720x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications. The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Drop-in replacement with upgraded functionality to the compared device
TMUX8109 ACTIVE 100-V, flat RON, dual 4:1 multiplexers with latch-up immunity and 1.8-V logic Pin-to-pin replacement with higher supply voltage support up to 100 V, ±50 V and powered-off protectio

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 4
Type Title Date
* Data sheet TMUX720x 44-V, Latch-Up Immune, 8:1, 1-Channel and 4:1, 2-Channel Precision Multiplexers with 1.8-V Logic datasheet (Rev. E) PDF | HTML 21 Jan 2022
Application note Guarding in Multiplexer Applications PDF | HTML 13 May 2022
Application note Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) 20 Sep 2021
Application brief Precision Multiplexers Reducing Barriers in an Industrial Environment PDF | HTML 21 May 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TMUXRUM-RRPEVM — TMUX generic evaluation module for 16-pin RUM and RRP quad-flatpack no-lead (QFN) packages

The TMUXRUM-RRPEVM allows for the quick prototyping and DC characterization of  the TI line of TMUX products that use 16-pin RUM or RRP packages (QFN) and is rated for high-voltage operation.

User guide: PDF | HTML
Not available on TI.com
Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Not available on TI.com
Simulation model

TMUX7209 IBIS Model

SCDM256.ZIP (51 KB) - IBIS Model
Simulation model

TMUX7209 Pspice Model

SCDM292.ZIP (231 KB) - PSpice Model
Package Pins Download
TSSOP (PW) 16 View options
WQFN (RUM) 16 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos