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Product details

Parameters

Regulated outputs (#) 4 Vin (Min) (V) 4 Vin (Max) (V) 18.3 Iout (Max) (A) 1.5 Step-down DC/DC converter 3 LDO 1 Iq (Typ) (mA) 0.1 Features I2C Control, Over Current Protection, Power Good, Power Sequencing, Power Supply and System Monitoring, Spread-Spectrum Clock (SSC) Generation, Thermal Shutdown, UVLO Fixed Operating temperature range (C) -40 to 125 Rating Automotive Configurability Factory programmable, Software configurable, User programmable open-in-new Find other Multi-channel ICs (PMIC)

Package | Pins | Size

VQFN (RGE) 24 16 mm² 4 x 4 open-in-new Find other Multi-channel ICs (PMIC)

Features

  • Qualified for automotive applications
  • AEC-Q100 grade 1 qualified
    • -40°C to +125°C ambient operating temperature range
  • Three step-down converters:
    • BUCK1 VIN range from 4 V to 18.3 V
    • BUCK1 output current up to 1500-mA
    • BUCK2 and BUCK3 VIN range from 3.0 V to 5.5 V
    • BUCK2 and BUCK3 output current up to 1200-mA
    • Spread-Spectrum Clock (SSC) generation for reduced EMI
    • 2.3-MHz Forced fixed switching frequency PWM operation
  • One low dropout (LDO) regulator:
    • VIN range from 3.0 V to 5.5 V
    • Low noise
    • Adjustable output voltage via I2C
    • Up to 300-mA output current
  • 4.0-mm × 4.0-mm 24-Pin VQFN with wettable flanks

All trademarks are the property of their respective owners.

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Description

The TPS650330-Q1 device is a highly integrated power management IC for automotive camera modules. This device combines three step down converters and one low-dropout (LDO) regulator. The BUCK1 step-down converter has an input voltage range up to 18.3 V for connections to Power over Coax (PoC). All converters operate in a forced fixed-frequency PWM mode. The LDO can supply 300 mA and operate with an input voltage range from 3.0 V to 5.5 V. The step-down converters and the LDO have separate voltage inputs that enable maximum design and sequencing flexibility.

The TPS650330-Q1 is available in a 24-pin VQFN package (4.0 mm × 4.0 mm).

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More information

Full data sheet, TPS650330Q1EVM, TPS65033x efficiency and thermal estimator, and TPS65033X PSPICE models are available. Request now

TPS65033X-Q1 functional safety documents are available. Request now

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 9
Type Title Date
* Datasheet TPS650330-Q1 Automotive Camera PMIC datasheet Apr. 10, 2019
Application note Camera PMIC Spin Selection Guide Oct. 29, 2020
User guide TPS650330Q1EVM User's Guide (Rev. A) Oct. 24, 2020
User guide TPS65033x Programming Board Users Guide (Rev. A) Oct. 19, 2020
Application note Passing CISPR-25 Radiated and Conduction Emissions Using the TPS65033x-Q1 (Rev. A) Oct. 13, 2020
Application note TPS650330-Q1 Powering multiple Image Sensors with the same Power Management IC Jun. 23, 2020
Application note TPS650330-Q1 Image Sensor Selection May 15, 2020
Technical articles Skip automotive camera module power circuit redesign with scalable PMICs Mar. 24, 2020
Application note High-Performance CMOS Image Sensor Power Supply in Industrial Camera and Vision Aug. 05, 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
149
Description
The TPS650330 customer programming boosterpack uses a MSP430F5529 Launcher in order to enable customer programming of the non-volatile memory of the TPS650330-Q1 Power Management IC. The BOOSTXL-TPS65033 features a socket for programming units before soldering down on the customer board.
Features
  • Programming
  • Configurable voltage outputs
  • Power sequencing
  • I²C communication and controls
EVALUATION BOARD Download
199
Description

The TPS650330Q1EVM is an evaluation board for the TPS65033x-Q1 Power Management IC. The EVM includes an onboard USB-to-I²C adapter, power terminals and jumpers for the regulator inputs and outputs, and test points for common measurements.

TPS65033x-Q1 device is a highly integrated power management IC (...)

Features
  • Programmable output voltages
  • Programmable power up and down sequencing
  • Programmable spreadspectrum on or off

Design tools & simulation

CALCULATION TOOL Download
Efficiency estimation tool for TPS6594-Q1, LP8756-Q1, LP8758, LP8770 and TPS650330-Q1
PEET-GUI — Efficiency estimator tool for Texas Instruments PMICs such as TPS6594-Q1, LP8756 family, LP8758 family and more.
Features
  • Efficiency data based on available measurement data
  • Automatic data plotting
  • Export efficiency curves

Reference designs

REFERENCE DESIGNS Download
Scalable automotive 2-MP camera module reference design with camera PMIC
TIDA-050035 This reference design provides a compact and scalable camera module for automotive driver assistance (ADAS) systems and other vision applications. It combines a 2-megapixel (2 MP) imager with a 4-Gbps serializer and four-channel power management integrated circuit (PMIC).

The camera module is a (...)

document-generic Schematic
REFERENCE DESIGNS Download
Automotive 2-MP camera module reference design for DMS and other camera modules
TIDA-050036 This reference design provides a compact and scalable camera module for automotive driver monitoring systems (DMS) and other vision applications. It combines a 2-megapixel (2 MP) imager with a 4-Gbps serializer and four-channel power management integrated circuit (PMIC).

The camera module is a (...)

document-generic Schematic
REFERENCE DESIGNS Download
Automotive 2-MP camera module reference design with MIPI CSI-2 interface, PMIC, FPD-Link III and POC
TIDA-020003 — This camera module reference design addresses the need for small cameras in automotive systems by combining a 2-megapixel imager with a 4-Gbps serliazier. Additionally, it provides power and voltage supervision from a single Power Management IC (PMIC). This design includes a high-speed serial (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
VQFN (RGE) 24 View options

Ordering & quality

Information included:
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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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