TS3A5223

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0.45-Ω, 3.3-V, 2:1 (SPDT), 2-channel analog switch with 1-V logic

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 2 Power supply voltage - single (V) 1.8, 2.5, 3.3 Ron (Typ) (Ohms) 0.45 ON-state leakage current (Max) (µA) 0.06 Bandwidth (MHz) 80 Operating temperature range (C) -40 to 85 Features Break-before-make, Supports I2C signals, 1.8-V compatible control inputs Input/output continuous current (Max) (mA) 300 Rating Catalog CON (Typ) (pF) 115 Supply current (Typ) (uA) 150 open-in-new Find other Analog switches & muxes

Package | Pins | Size

UQFN (RSW) 10 3 mm² 1.8 x 1.4 open-in-new Find other Analog switches & muxes

Features

  • Low ON Resistance Switches
    • 0.45 Ω (Typical) at 3.6 V
    • 0.85 Ω (Typical) at 1.8 V
  • Wide Supply Range: 1.65 V to 3.6 V
  • 1.0 V Compatible Logic Interface
  • High Switch Bandwidth 80 MHz
  • 0.01% THD Across Entire Band
  • Specified min Break-before-make
  • Bi-directional Switching
  • –75 dB Channel-to-Channel Crosstalk
  • –70 dB Channel-to-Channel OFF Isolation of Very Low Power Dissipation and Leakage Currents
  • Very Small QFN-10 Package: 1.8 mm × 1.4 mm
  • ESD Protection on all Pins
    • 2 kV HBM, 500 V CDM

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Description

The TS3A5223 is a high-speed 2-channel analog switch with break-before-make and bi-directional signal switching capability. The TS3A5223 can be used as a dual 2:1 multiplexer or a 1:2 dual de-multiplexer.

The TS3A5223 offers very low ON resistance, very low THD, channel-to-channel crosstalk and very high OFF isolation. These features make TS3A5223 suitable for application in Audio signal routing and switching applications.

The TS3A5223 control logic supports 1 V – 3.6 V CMOS logic levels. The logic interface allows direct interface with a wide range of CPUs and microcontrollers without increasing the current drawn from supply (ICC) and thus lowering power consumption.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 7
Type Title Date
* Datasheet TS3A5223 0.45 Ω 2-Channel SPDT Bidirectional Analog Switch datasheet (Rev. B) Apr. 11, 2017
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Application notes 1.8 V Logic for Muxes and Signal May 16, 2018
Application notes Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

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Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

CAD/CAE symbols

Package Pins Download
UQFN (RSW) 10 View options

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