3.3-V, 2:1 (SPDT), 4-channel 10/100 Base-T LAN switch
Product details
Parameters
Package | Pins | Size
Features
- Wide bandwidth (BW = 500 MHz typical)
- Low crosstalk (XTALK = –30 dB typical)
- Bidirectional data flow with near-zero propagation delay
- Low and flat ON-state resistance
(ron = 4 Ω typical, ron(flat) = 1 Ω) - Switching on Data I/O Ports (0 to 5 V)
- VCC Operating range from 3 V to 3.6 V
- Ioff Supports partial power-down-mode operation
- Data and control inputs have undershoot clamp diodes
- Latch-up performance exceeds 100 mA Per
JESD 78, class II - ESD Performance tested per JESD 22
- 2000-V Human-body model
(A114-B, class II) - 1000-V Charged-device model (C101)
- 2000-V Human-body model
- Suitable for both 10 Base-T and 100 Base-T signaling
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Description
The TS3L110 local area network (LAN) switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input. When E is low, the switch is enabled, and the I port is connected to the Y port. When E is high, the switch is disabled, and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.
The TS3L110 device can be used to replace mechanical relays in LAN applications. This device has low and flat ON-state resistance (ron), wide bandwidth, and low crosstalk, making it suitable for 10/100 Base-T and various other LAN applications. The TS3L110 device can be used to route signals from a 10/100 Base-T Ethernet transceiver to the RJ-45 LAN connectors in laptops or in docking stations. This device is designed for low channel-to-channel skew and low crosstalk.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current does not backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | TS3L110 Quad SPDT High-Bandwidth 10/100 Base-T LAN Switch Differential 8-Channel to 4-Channel Multiplexer/Demultiplexer datasheet (Rev. B) | Oct. 10, 2019 |
| Technical articles | Roll with the design punches and overcome power-sequencing challenges | Jul. 29, 2019 | |
| Application notes | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
| Application notes | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
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Features
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- TPS65911A PMIC
- Audio and serial expansion headers
- Processor SDK Linux and TI-RTOS support
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| SOIC (D) | 16 | View options |
| SSOP (DBQ) | 16 | View options |
| TSSOP (PW) | 16 | View options |
| TVSOP (DGV) | 16 | View options |
| VQFN (RGY) | 16 | View options |
Ordering & quality
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