TS3V330

ACTIVE

3.3-V, 2:1 (SPDT), 4-channel video switch

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Product details

Parameters

Protocols RGB, Composite Configuration 2:1 SPDT Number of channels (#) 4 Bandwidth (MHz) 300 Supply voltage (Max) (V) 3.6 Supply voltage (Min) (V) 3 Ron (Typ) (Ohms) 5 Input/ouput voltage (Min) (V) 0 Input/ouput voltage (Max) (V) 3.6 Supply current (Typ) (uA) 10 ESD HBM (Typ) (kV) 2 Operating temperature range (C) -40 to 85 Crosstalk (dB) -80 ESD CDM (kV) 1 ICC (Typ) (uA) 10 Input/output continuous current (Max) (mA) 128 COFF (Typ) (pF) 10 CON (Typ) (pF) 17 Off isolation (Typ) (dB) -50 OFF-state leakage current (Max) (µA) 1 Propagation delay (ns) 2.5 Ron (Max) (Ohms) 10 Turn off time (disable) (Max) (ns) 3.5 Turn on time (enable) (Max) (ns) 6.5 VIH (Min) (V) 2 VIL (Max) (V) 0.8 open-in-new Find other Protocol-specific switches & muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 TVSOP (DGV) 16 23 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5 open-in-new Find other Protocol-specific switches & muxes

Features

  • Low Differential Gain and Phase (DG = 0.82%, DP = 0.1 Degree Typ)
  • Wide Bandwidth (BW = 300 MHz Min)
  • Low Crosstalk (XTALK = -80 dB Typ)
  • Low Power Consumption (ICC = 10 µA Max)
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron = 3 Typ)
  • Rail-to-Rail Switching on Data I/O Ports (0 to VCC)
  • VCC Operating Range From 3 V to 3.6 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Provide Undershoot Clamp Diode
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both RGB and Composite-Video Switching

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Description

The TS3V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer, with a single switch-enable (EN) input. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer.

Low differential gain and phase make this switch ideal for composite and RGB video applications. This device has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.

To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 4
Type Title Date
* Datasheet TS3V330 datasheet (Rev. C) Jul. 11, 2005
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Application notes Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Reference designs

REFERENCE DESIGNS Download
Highly Efficient, 1.6kW High Density GaN Based 1MHz CrM Totem-pole PFC Converter Reference Design
TIDA-00961 — High frequency Critical-Conduction-Mode (CrM) Totem-pole power factor correction (PFC) is a simple approach for designing high density power solutions using GaN.  The TIDA-0961 reference design uses TI’s 600V GaN power stage, LMG3410, and TI’s Piccolo™ F280049 controller. This (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Wireless Subwoofer Amplifier Reference Design
TIDA-00232 This wireless subwoofer amplifier reference design demonstrates the ease of integrating wireless connectivity to a traditional analog input subwoofer design.The wired or wireless mode is controlled by an MSP430. The reference design includes a high performance stereo digital audio amplifier system (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
SSOP (DBQ) 16 View options
TSSOP (PW) 16 View options
TVSOP (DGV) 16 View options
VQFN (RGY) 16 View options

Ordering & quality

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