3.3-V, 2:1 (SPDT), 4-channel video switch
Product details
Parameters
Package | Pins | Size
Features
- Low Differential Gain and Phase (DG = 0.82%, DP = 0.1 Degree Typ)
- Wide Bandwidth (BW = 300 MHz Min)
- Low Crosstalk (XTALK = -80 dB Typ)
- Low Power Consumption (ICC = 10 µA Max)
- Bidirectional Data Flow With Near-Zero Propagation Delay
- Low ON-State Resistance (ron = 3
Typ)
- Rail-to-Rail Switching on Data I/O Ports (0 to VCC)
- VCC Operating Range From 3 V to 3.6 V
- Ioff Supports Partial-Power-Down Mode Operation
- Data and Control Inputs Provide Undershoot Clamp Diode
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
- Suitable for Both RGB and Composite-Video Switching
Description
The TS3V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer, with a single switch-enable (EN) input. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer.
Low differential gain and phase make this switch ideal for composite and RGB video applications. This device has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.
To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TS3V330 datasheet (Rev. C) | Jul. 11, 2005 |
Application note | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Reference designs
Design files
-
download TIDA-00961 Assembly Drawing.pdf (482KB) -
download TIDA-00961 PCB.pdf (2240KB) -
download TIDA-00961 BOM (Rev. A).pdf (50KB) -
download TIDA-00961 CAD Files (Rev. B).zip (4493KB) -
download TIDA-00961 Gerber (Rev. A).zip (1428KB)
Design files
-
download TIDA-00232 BOM (SAT0018).pdf (112KB) -
download TIDA-00232 BOM (TAS5624ADDVEVM).pdf (36KB) -
download TIDA-00232 Gerber.zip (706KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SOIC (D) | 16 | View options |
SSOP (DBQ) | 16 | View options |
TSSOP (PW) | 16 | View options |
TVSOP (DGV) | 16 | View options |
VQFN (RGY) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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