TS3V340

ACTIVE

3.3-V, 2:1 (SPDT), 4-channel video switch with flat on-state resistance

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Product details

Parameters

Protocols RGB, Composite Configuration 2:1 SPDT Number of channels (#) 4 Bandwidth (MHz) 500 Supply voltage (Max) (V) 3.6 Supply voltage (Min) (V) 3 Ron (Typ) (Ohms) 3 Input/ouput voltage (Min) (V) 0 Input/ouput voltage (Max) (V) 5.5 ICC (Max) (uA) 1500 ESD HBM (Typ) (kV) 2 Operating temperature range (C) -40 to 85 Crosstalk (dB) -80 ESD CDM (kV) 1 ICC (Typ) (uA) 700 Input/output continuous current (Max) (mA) 128 COFF (Typ) (pF) 3.5 CON (Typ) (pF) 10.5 Off isolation (Typ) (dB) -60 OFF-state leakage current (Max) (µA) 1 Propagation delay (ns) 2 Ron (Max) (Ohms) 6 RON flatness (Typ) (Ohms) 1 Turn off time (disable) (Max) (ns) 7 Turn on time (enable) (Max) (ns) 7 VIH (Min) (V) 2 VIL (Max) (V) 0.8 open-in-new Find other Protocol-specific switches/muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 TVSOP (DGV) 16 23 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5 open-in-new Find other Protocol-specific switches/muxes

Features

  • Low Differential Gain and Phase (DG = 0.2%, DP = 0.1° Typ)
  • Wide Bandwidth (BW = 500 MHz Typ)
  • Low Crosstalk (XTALK = –80 dB Typ)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low and Flat ON-State Resistance (ron = 3 Typ)
  • VCC Operating Range From 3 V to 3.6 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Provide Undershoot Clamp Diode
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both RGB and Composite Video Switching

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Description

The TI video switch TS3V340 is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (EN)\ input. When EN\ is low, the switch is enabled and the D port is connected to the S port. When EN\ is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer.

Low differential gain and phase makes this switch ideal for composite and RGB video applications. The device has a wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.

To ensure the high-impedance state during power up or power down, EN\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Technical documentation

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Type Title Date
* Datasheet TS3V340 datasheet (Rev. A) Dec. 02, 2004
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Technical articles Is charge injection causing output voltage errors in your industrial control system? Oct. 18, 2018
Application notes Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODELS Download
SCDM095.ZIP (44 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
SSOP (DBQ) 16 View options
TSSOP (PW) 16 View options
TVSOP (DGV) 16 View options
VQFN (RGY) 16 View options

Ordering & quality

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