0.65-V, 2:1 (SPDT), 2-channel analog switch with negative signaling capability
Product details
Parameters
Package | Pins | Size
Features
- Specified break-before-make switching
- Negative signaling capability: maximum swing from –2.75 V to 2.75 V (VCC = 2.75 V)
- Low ON-state resistance (0.65 Ω typical)
- Low charge injection
- Excellent ON-state resistance matching
- 2.3-V to 5.5-V Power supply (VCC)
- Latch-Up performance exceeds 100 mA Per JESD 78, Class II
- ESD Performance tested per JESD 22
- 2500-V Human-body model
(A114-B, class II) - 1500-V Charged-device model (C101)
- 200-V Machine model (A115-A)
- 2500-V Human-body model
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Description
The TS5A22362 is a bidirectional, 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00 mm × 3.00 mm DRC package is also available as a nonmagnetic package for medical imaging application.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Data sheet | TS5A22362 0.65-Ω 2-channel SPDT Analog Switches With Negative Signaling Capability datasheet (Rev. E) | Sep. 25, 2019 |
| Application note | Multiplexers and Signal Switches Glossary (Rev. A) | Jun. 09, 2021 | |
| Application note | 1.8 V Logic for Muxes and Signal (Rev. A) | Jan. 06, 2021 | |
| Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
| Application note | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Design tools & simulation
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| DSBGA (YZP) | 10 | View options |
| VSON (DRC) | 10 | View options |
| VSSOP (DGS) | 10 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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