TS5A22364

ACTIVE

0.65-Ω, 5-V, 2:1 (SPDT), 2-channel analog switch with negative signaling capability

Top

Product details

Parameters

Protocols Analog Audio Configuration 2:1 SPDT Number of channels (#) 2 Bandwidth (MHz) 18.3 Supply voltage (Max) (V) 5.5 Supply voltage (Min) (V) 2.3 Ron (Typ) (Ohms) 0.52 Input/ouput voltage (Min) (V) -3.2 Input/ouput voltage (Max) (V) 5.5 Supply current (Typ) (uA) 0.1 ESD HBM (Typ) (kV) 1.5 Operating temperature range (C) -40 to 85 Crosstalk (dB) -78 ESD CDM (kV) 1.5 Input/output continuous current (Max) (mA) 350 CON (Typ) (pF) 370 Off isolation (Typ) (dB) -70 Ron (Max) (Ohms) 1.3 Ron channel match (Max) (Ohms) 0.3 Turn on time (enable) (Max) (ns) 120 VIH (Min) (V) 1.4 VIL (Max) (V) 0.8 open-in-new Find other Protocol-specific switches & muxes

Package | Pins | Size

DSBGA (YZP) 10 3 mm² 1.9 x 1.4 VSON (DRC) 10 9 mm² 3.00 x 3.00 VSSOP (DGS) 10 9 mm² 3 x 3 open-in-new Find other Protocol-specific switches & muxes

Features

  • Specified Break-Before-Make Switching
  • Negative Signaling Capability: Maximum Swing from –2.75 V to 2.75 V (VCC = 2.75 V)
  • Internal Shunt Switch Prevents Audible Click-and-Pop When Switching Between Two Sources
  • Low ON-State Resistance (0.65 Ω Typical)
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • 2.3-V to 5.5-V Power Supply (VCC)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2500-V Human-Body Model
      (A114-B, Class II)
    • 1500-V Charged-Device Model (C101)
    • 200-V Machine Model (A115-A)

All trademarks are the property of their respective owners.

open-in-new Find other Protocol-specific switches & muxes

Description

The TS5A22364 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click/pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00-mm x 3.00-mm DRC package is also available as a nonmagnetic package for medical imaging applications.

open-in-new Find other Protocol-specific switches & muxes
Download

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 6
Type Title Date
* Datasheet TS5A22364 0.65-Ω Dual SPDT Analog Switches With Negative Signaling Capability datasheet (Rev. H) Jun. 21, 2017
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note 1.8 V Logic for Muxes and Signal May 16, 2018
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODEL Download
SCDM122.ZIP (67 KB) - IBIS Model
SIMULATION MODEL Download
SCDM123.ZIP (105 KB) - HSpice Model

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 10 View options
VSON (DRC) 10 View options
VSSOP (DGS) 10 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos