1-Ω, 5-V, 2:1 (SPDT), 2-channel analog switch with powered-off protection
Product details
Parameters
Package | Pins | Size
Features
- Isolation in Power-Down Mode, VCC = 0
- Specified Break-Before-Make Switching
- Low ON-State Resistance (1 Ω)
- Control Inputs are 5.5-V Tolerant
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion (THD)
- Supports Analog and Digital Signals
- 1.65-V to 5.5-V Single-Supply Operation
- Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II - ESD Performance Tested Per JESD 22
- 2000-V Human Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human Body Model
Description
The TS5A23159 is a bidirectional 2-channel single-pole double-throw (SPDT) switch that is designed to operate from 1.65 V to 5.5 V. The device offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature which prevents signal distortion during the transferring of a signal from one channel to another. The device has an excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for a wide variety of portable applications including cell phones, audio devices, and instrumentation.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TS5A23159 1-Ω 2-Channel SPDT Analog Switch 5-V / 3.3-V 2-Channel 2:1 Multiplexer / Demultiplexer datasheet (Rev. H) | Feb. 26, 2015 |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Application note | Eliminate power Sequencing with powered-off protection signal switches (Rev. B) | Jan. 15, 2019 | |
Application note | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Reference designs
Design files
-
download TIDA-00018 BOM.pdf (202KB) -
download TIDA-00018 PCB.pdf (645KB) -
download TIDA-00018 Altium.zip (3888KB) -
download TIDA-00018 Gerber.zip (319KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
UQFN (RSE) | 10 | View options |
VSSOP (DGS) | 10 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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