Top

Product details

Parameters

Number of input channels 16 Interface Serial Active supply current (Typ) (mA) 3.6 Supply voltage (Max) (V) 5.5 Operating temperature range (C) 0 to 70 Approx. price (US$) 35.20 | 1ku open-in-new Find other Ultrasound AFEs

Features

  • Transmitter supports:
    • 16-channel 3-level or 8-channel 5-level pulser and active transmit/receive (T/R) switch
    • Very low power on-chip beamforming mode (5-level mode):
      • In receive-only mode: 17 mW
      • In transmit-receive mode: 598 mW
      • In CW mode (0.6-A mode): 1.97 W
      • In global power-down mode: 4.3 mW
  • 3-level, 5-level pulser:
    • Maximum output voltage: ±100 V
    • Minimum output voltage: ±1 V
    • Maximum output current: 2.4 A to 0.6 A
    • Maximum clamp current: 1 A to 0.25 A (in 3-level mode)
    • Maximum clamp current: 2 A to 0.5 A (in 5-level mode)
    • Second harmonic of –45 dBc at 5 MHz
    • CW mode jitter: 100 fs measured from 100 Hz to 20 kHz
    • CW mode close-in phase noise: –154 dBc/Hz at 1 kHz offset for 5 MHz signal
    • Supports 4.8-A mode in 5-level mode
    • –3-dB Bandwidth with 1-kΩ || 240-pF load
      • 20 MHz (For ±100-V supply in 2.4-A mode)
      • 36 MHz (For ±100-V supply in 4.8-A mode)
      • 25 MHz (For ±70-V supply in 2.4-A mode)
  • Active transmit/receive (T/R) switch with:
    • ON/OFF control signal
    • Turnon resistance of 12 Ω
    • Bandwidth: 50 MHz
    • HD2: -50 dBc
    • Turnon time: 0.5 µs
    • Turnoff time: 1.75 µs
    • Transient glitch: 50 mVPP
  • Off-chip beam former with:
    • Jitter cleaning using synchronization feature
    • Maximum synchronization clock frequency: 200 MHz
  • On-chip beam former with:
    • Delay resolution: one beamformer clock period, minimum 5 ns
    • Maximum delay: 213 beamformer clock period
    • Maximum beamformer clock speed: 200 MHz
    • On-chip RAM to store
      • 16 Delay profiles
      • 48/28 pattern-profiles for 3- or 5-level mode
  • High-speed (100 MHz maximum) 1.8-V and 2.5-V CMOS serial programming interface
  • Automatic thermal shutdown
  • No specific power sequencing requirement in 3-level mode
  • Small package: NFBGA-216 (15 mm × 10 mm) with 0.8-mm pitch

All trademarks are the property of their respective owners.

open-in-new Find other Ultrasound AFEs

Description

The TX7316 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 16 pulser circuits (PULS), 16 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

The TX7316 (referred to as device in this data sheet) has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 8 outputs for 5-level mode and 16 outputs for 3-level mode. The maximum output current is configurable from 2.4 A to 0.6 A.

A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 12-Ω impedance in the ON state.

Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7316 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation.

In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal.

In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 48/28 pattern profiles for 3/5-level mode can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device.

TX7316 is available in a 15-mm × 10-mm 216-pin NFBGA package (ZCX package) and is specified for operation from 0°C to 70°C.

open-in-new Find other Ultrasound AFEs
Download

More information

Full data sheet and other design resources are available. Request access now

Technical documentation

= Featured
No results found. Please clear your search and try again. View all 3
Type Title Date
* Datasheet TX7316 Three-Level, 16-Channel or Five-Level, 8-Channel Transmitter With 2.4-A Pulser, T/R Switch, and Integrated Transmit Beamformer datasheet (Rev. B) Jul. 02, 2019
Application notes Designing High Voltage Power Supply for Ultrasound Smart Probes Oct. 22, 2019
User guides TX7316EVM Evaluation Module User's Guide (Rev. A) May 24, 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
$199.00
Description
The TX7316 evaluation module (EVM) evaluates the TX7316 device and its features.
Features
  • 16-channel 3-level pulser or 8-channel 5-level pulser with output voltage support of ±2.5 V to ±100 V and current drive of 0.6 A to 2.4 A
  • Active transmit/receive (T/R) switch
  • Both off-chip and on-chip beamforming
  • Integrated floating power supply
  • Automatic thermal shutdown

CAD/CAE symbols

Package Pins Download
(ZCX) 216 View options

Ordering & quality

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​