1-Bit Bidirectional Voltage-Level Shifter With Auto Direction Sensing and +/-15-kV ESD Protect
Product details
Parameters
Package | Pins | Size
Features
- Available in the Texas Instruments NanoFree™ Package
- 1.2 V to 3.6 V on A Port and
1.65 V to 5.5 V on B Port (VCCA ≤ VCCB) - VCC Isolation Feature – If Either VCC Input is at GND, All Outputs are in the High-Impedance State
- OE Input Circuit Referenced to VCCA
- Low Power Consumption, 5 µA Maximum ICC
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- A Port
- 2000 V Human Body Model (A114-B)
- 250 V Machine Model (A115-A)
- 1500 V Charged-Device Model (C101)
- B Port
- 15 kV Human Body Model (A114-B)
- 250 V Machine Model (A115-A)
- 1500 V Charged-Device Model (C101)
- A Port
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Description
This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Same functionality but is not pin-for-pin or parametrically equivalent to the compared device:
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TXB0101 1-Bit Bidirectional Level-Shifting and Voltage Translator With Auto Direction-Sensing and ±15-kV ESD Protection datasheet (Rev. D) | Mar. 13, 2017 |
User guide | TXB-EVM Evaluation Module Users Guide | Oct. 08, 2019 | |
Selection guide | Voltage translation buying guide | Jun. 13, 2019 | |
Application note | Effects of pullup and pulldown resistors on TXS and TXB devices (Rev. A) | Mar. 28, 2018 | |
Application note | Factors Affecting VOL for TXS and LSF Auto-bidirectional Translation Devices | Nov. 19, 2017 | |
Application note | Biasing Requirements for TXS, TXB, and LSF Auto-Bidirectional Translators | Oct. 30, 2017 | |
Application note | A Guide to Voltage Translation With TXS-Type Translators | Jun. 29, 2010 | |
Application note | A Guide to Voltage Translation With TXB-Type Translators | Mar. 03, 2010 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Description
Features
- Supports the TXB0101, TXB0102, TXB0104, TXB0108
- Supports DCK, DCU, RUT and RGY packages of TI
- Option of individual external loading per channel
- Additional package options supported on the same footprint
Design tools & simulation
Reference designs
Design files
-
download TIDA-00403 BOM.pdf (282KB) -
download TIDA-00403 Assembly Drawing.pdf (1710KB) -
download TIDA-00403 PCB.pdf (1839KB) -
download TIDA-00403 CAD Files.zip (11KB) -
download TIDA-00403 Gerber.zip (3899KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
DSBGA (YZP) | 6 | View options |
SC70 (DCK) | 6 | View options |
SOT-23 (DBV) | 6 | View options |
SOT-5X3 (DRL) | 6 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
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